| Lubrication Layer Perturbations in Chemical-Mechanical Polishing (2005) | |||||||||||
Abstract | |||||||||||
| Lubrication Layer Perturbations Chemical Mechanical Polishing Len Borucki CTO Araca Inc LJB MPI Outline quick tutorial chemical mechanical polishing CMP Elastohydrodynamic lubrication with pure lubricant Questions posed the presence slurry particles LJB MPI Quick CMP Tutorial LJB MPI Wafer Planarization Integrated Circuit Fabrication Integrated circuits are made deposition and modification numerous material layers Photolithography the main method creating patterns works best flat surfaces Chemical Mechanical Polishing CMP currently the leading method for planarizing surfaces Peter Wolters Schematic integrated circuit produced without CMP Schematic integrated circuit produced with CMP LJB MPI Generic Rotary Polishing Tool rotating tool with diamond covered face maintains pad surface roughness counteracting abrasive wear removing debris exposing new pad surface The wafer held upside down rotating carrier The wafer surface reacts with chemicals the slurry and abraded slurry particles The pad also experiences abrasive wear Slurry Stream Puddle Conditioner Wafer Carrier Wafer Polishing Pad Platen Commercial tool AMAT Reflexion Bench top polisher Struers Photo Rob Hight Georgia Tech LJB MPI Polishing Pads The most commonly used pad Rohm and Haas closed cell polyurethane foam with mean void diameter about microns Voids occupy about the volume and are not interconnected except the surface The pad shown here next scaled drawing m wide deep trench The pad surface roughness large compar | |||||||||||
Publication details | |||||||||||
| |||||||||||
Cited publications (1) | |||||||||||
| |||||||||||