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Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces (2006) |
- Töpper, M.,
- Klein, M.,
- Buschick, K.,
- Glaw, V.,
- Orth, K.,
- Ehrmann, O.,
- Hutter, M.,
- Oppermann, H.,
- Braun, T.,
- Ebling, F.,
- Reichl, H.,
- Kim, S.,
- Tathireddy, P.,
- Chakravarty, S.,
- Solzbacher, F.
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Publication details |
| Repository |
Fraunhofer Publica (Germany) |
| Type |
Conference Paper
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| Language |
english
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| Relation |
Institute of Electrical and Electronics Engineers -IEEE-: ECTC 2006, the 56th Electronic Components and Technology Conference. Proceedings. CD-ROM: May 30 - June 2, 2006, held at Sheraton, San Diego, California. New York, NY: IEEE, 2006, pp. 705-708
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