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Nano-scaled functional layers for current and heat transport in electronics packaging (2008)

Publication details
Repository Fraunhofer Publica (Germany)
Type Conference Paper, Electronic Publication
Language english
Relation Institute of Electrical and Electronics Engineers -IEEE-: 2nd Electronics Systemintegration Technology Conference, ESTC 2008. Proceedings: 1st - 4th September 2008, Greenwich, London, UK. Piscataway, NJ: IEEE, 2008, pp. 333-338