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Nano-scaled functional layers for current and heat transport in electronics packaging (2008)

Publication details

Download	http://publica.fraunhofer.de/documents/N-81619.html
Repository	Fraunhofer EPrints (Germany)
Type	Conference Paper, Electronic Publication
Language	english
Relation	Institute of Electrical and Electronics Engineers -IEEE-: 2nd Electronics Systemintegration Technology Conference, ESTC 2008. Proceedings: 1st - 4th September 2008, Greenwich, London, UK. Piscataway, NJ: IEEE, 2008, pp. 333-338