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Fabrication of Cu(Ti) alloy interconnects with self-formation of thin barrier metal layers using a high-pressure annealing process (2007)

Publication details

Download	http://hdl.handle.net/2433/67480
Publisher	MINERALS METALS MATERIALS SOC
Repository	Kyoto University Research Information Repository (KURENAI) (Japan)
Keywords	Cu-Ti alloy, interconnect, self-formation, barrier layer, high-pressure annealing
Type	Journal Article
Language	English
Relation	10.1007/s11664-007-0274-6