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Studies on MCM-D Interconnections (2007)

Abstract
In the context of the development of the ATLAS Pixel Detector [1], a multi chip module technology called MCM{D (multi chip module deposited) has been studied to implement the high density interconnect. The results of some rst assemblies using 'standard' sensor designs have been reported in [2].

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Download http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.8.1678
Source http://www.uni-wuppertal.de/FB8/groups/Teilchenphysik/paper/gerlachPix02.ps.gz
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Type text
Language English