| Studies on MCM-D Pixel-Detector-Modules (2007) | |||||||||||||
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| Introduction The idea of MCM-D is to place all connections in a module between the front end chips and the sensor. This takes advantage of the hydrid pixel approach and the only assembly technique is bump bonding. MDM-D uses BCB (Benzo Cyclo Butene, Cyclotene TM , Dow Chemical Inc., USA) and copper to deposit the connecting structures. This can be done by using wafer level techniques as spin-on, sputtering, and electro-plating. The thickness of the copper layers is determined by the voltage drop on the power supply lines, so that one can operate all electronic chips correctly, even at maximal voltage dierence. Aiming to minimize the voltage drop four layers are built up of 3.5 m thick copper. Signal lines are placed above a ground plane to build up a micro strip con guration. This ensures high signal quality and low crosstalk between neighboured lines. Integrating all connections on the sensor gives an additional freedom: Small structures, called 'feed-throughs', are used to conn | |||||||||||||
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