Wunderle, B., Braun, T., May, D., Michel, B., Reichl, H.
The use of multilayer ceramic chip capacitors as integrated passive in, e.g., system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive...
Vogel, D., Auersperg, J., Michel, B.
This paper focuses on some advanced aspects of physics of failure approaches. Tracing of failure modes under realistic loading is a key issue to separate relevant failure sites to be studied in more...
Lifetime modelling for microsystems integration: From nano to systems (2009)
Due to the rapid development of IC technology the traditional packaging concepts are making a transition into more complex system integration techniques in order to enable the constantly increasing...
Michel, B., Giza, M., Krumrey, M., Eichler, M., Grundmeier, G.
Silicon wafers were exposed to a dielectric barrier discharge (DBD) at atmospheric pressure, which was ignited by applying a high voltage (>12 kV peak voltage) to a small gap (d(g)=300 mu m) above...
Crack and damage evaluation in low-k BEoL stacks under chip package interaction aspects (2009)
Auersperg, J., Vogel, D., Lehr, M.U., Grillberger, M., Michel, B.
The electronic industry drive for miniaturization and increasing functional integration forces the development of feature sizes down to the nanometer range. Moreover, harsh environmental conditions...
Characterisation and modelling of the nanoindentation experiment in Au layers (2009)
Wittler, O., Mrossko, R., Huber, S., Gollhardt, A., Michel, B.
The nanoindentation experiment is an established technique for the determination of Hardness and Young's modulus of thin films. This standard data set is not sufficient to he used as input to finite...
Influence of moisture on the time and temperature dependent properties of polymer systems (2009)
Walter, H., Dermitzaki, E., Shirangi, H., Wunderle, B., Hartmann, S., Michel, B.
The use of temperature and time dependent material parameters is state-of-the-art in mechanical engineering. An advanced measurement method for the determination of moisture dependent parameters for...
Thermo-mechanical reliability assessment for 3D through-Si stacking (2009)
Dudek, R., Brämer, B., Irsigler, R., Rzepka, S., Michel, B.
The through silicon interconnection technology for stacked dies is a promising way of future package construction as it lowers yield risks of large die sizes and allows cost effective packaging...
Wunderle, B., Dermitzaki, E., Holck, O., Bauer, J., Walter, H., Shaik, Q., ...
In this paper the potential of molecular dynamics simulation for structure-property correlations in epoxy-resins is discussed. This is a topic relevant for a multi-scale framework to lifetime...
Simulation based analysis of secondary effects on solder fatigue (2009)
Dudek, R., Doering, R., Bombach, C., Michel, B.
Secondary effects on thermal fatigue of solderjoints, which frequently have been neglected, were studied by means of the finite element method (FEM). Based on a semi-empirical approach to predict...
Sommer, J.P., Michel, B., Noack, E., Seiler, B.
More and more dense packaging is one of the most important challenges in advanced electronics and micro technology. One way to achieve this is to bury active as well as passive components into the...
Effects on silanol condensation during low temperature silicon fusion bonding (2009)
Eichler, M., Michel, B., Hennecke, P.
This paper presents the results of surface energy measurements performed in situ during annealing of silicon wafers. The method allows conclusions to be drawn about the progress of silanol...
Wunderle, B., Sinning, R., Wittler, O., Schacht, R., Walter, H., ...
In this paper we examine the thermo-mechanical reliability of polymer-encapsulated chip-on-board (COB) assemblies for power applications by simulation and experiment. Thereby the focus is set on the...
Bondenergie-Messung in situ während des Temperns beim Direktbonden von Glas und Silizium (2009)
Eichler, M., Michel, B., Hennecke, P.
This paper presents a method for surface energy measurements performed in situ during annealing of silicon and glass wafers. With this method the effect of silicon and borosilicat glass wafer...
May, D., Wunderle, B., Abo Ras, M., Faust, W., Gollhard, A., Schacht, R., ...
IR-thermography has become increasingly important for non-destructive testing of microelectronic devices and structures on chip, package and board-level. This paper focuses on the evaluation of best...
Wunderle, B., Kleff, J., Mrossko, R., Abo Ras, M., May, D., Schacht, R., ...
Thermal characterisation of thermal interfaces becomes even tougher a challenge at low bond line thicknesses and higher thermal conductivities of the interface materials as more accurate measurement...
Challenges for multi-scale modeling of multiple failure modes in microelectronics packaging (2008)
Auersperg, J., Dudek, R., Vogel, D., Michel, B.
Design for thermo-mechanical reliability of electronics components on the basis of parameterized Finite Element Models and DoE/RSM-approaches (Design of Experiments/Response Surface Methods) are more...
Sommer, J.P., Michel, B., Noack, E., Seiler, B.
More and more dense packaging is one of the most important challenges in advanced electronics and micro technology, driven by requirements like low cost and high reliability. One way to meet these...
Power plant conceptual study - WCLL concept. (2003)
Sardain, P., Michel, B., Giancarli, L., Li Puma, A., Poitevin, Y., Szczepanski, J., ...
22nd Symp.on Fusion Technology (SOFT), Helsinki, SF, September 9-13, 2002
Essential elements of quality assurance of clinical trials in hospital setting (1996)
ChaumetRiffaud, P, Allard, M, Billardon, M, Cattelin, F, Childs, M, ...
This round table discussion was devoted to describing the present status of clinical trials in the hospital setting, analysing common difficulties in conducting quality clinical research, and...
Kullig, E., Johansson, T., Brückner-Foit, A., Riesch-Oppermann, H., Munz, D., Winkler, T., ...
Wissenschaftliche Berichte, FZKA-5692 (Februar 96)
The Major Portal of Entry of Koi Herpesvirus in Cyprinus carpio Is the Skin▿
Costes, B., Raj, V. Stalin, Michel, B., Fournier, G., Thirion, M., Gillet, L., ...
Koi herpesvirus (KHV), recently designated Cyprinid herpesvirus 3, is the causative agent of a lethal disease in koi and common carp. In the present study, we investigated the portal of entry of KHV...