Zhang, Rongwei, Li, Yi, Yim, Myung Jin, Moon, Kyoung Sik, Lu, Daoqiang Daniel, Wong, C. P.
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Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill (2009)
Lee, Sangil, Yim, Myung Jin, Master, Raj N., Wong, C. P., Baldwin, Daniel F.
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Li, Yi, Yim, Myung Jin, Moon, Kyoung Sik, Wong, C. P.
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Conformal Magnetic Composite RFID for Wearable RF and Bio-Monitoring Applications (2008)
Yang, Li, Martin, Lara J., Staiculescu, Daniela, Wong, C. P., Tentzeris, Manos M.
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Recent Advances in High-k Nanocomposite Materials for Embedded Capacitor Applications (2008)
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Void Formation Study of Flip Chip in Package Using No-Flow Underfill (2008)
Lee, Sangil, Yim, Myung Jin, Master, Raj N., Wong, C. P., Baldwin, Daniel F.
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A Novel Nanocomposite with Photo-Polymerization for Wafer Level Application (2008)
Sun, Yangyang, Jiang, Hongjin, Zhu, Lingbo, Wong, C. P.
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Lara Martin, Daniela Staiculescu, Haiying Li, S. L. Ooi, C. P. Wong, Manos M. Tentzeris
Abstract- The successful implementation of a magnetic composite material has enabled the investigation of the potential impact on RFID and RF passives miniaturization, considering both...
Swapan K. Bhattacharya, Brian M. Gardner, Jianmin Qu, Daniel F. Baldwin, Rao R. Tummala, Contract Mda, ...
Raytheon) for many helpful discussions.
Hierarchical silicon etched structures for controlled hydrophobicity/superhydrophobicity (2007)
Xiu, Yonghao, Zhu, Lingbo, Hess, Dennis W., Wong, C. P.
Silicon surface hydrophobicity has been varied by using silane treatments on silicon pyramid surfaces generated by KOH anisotropic etching. Results demonstrated that by altering the surface...
Dong, Hai, Li, Yi, Yim, Myung Jin, Moon, Kyoung-Sik, Wong, C. P.
©2007 American Institute of Physics. The electronic version of this article is the complete one and can be found online at: http://link.aip.org/link/?APPLAB/90/092102/1
Monolayer protection for eletrochemical migration control in silver nanocomposite (2006)
©2006 American Institute of Physics. The electronic version of this article is the complete one and can be found online at: http://link.aip.org/link/?APPLAB/89/112112/1
A Novel Aluminum-Filled Composite Dielectric for Embedded Passive Applications (2006)
Wong, C. P., Xu, Jianwen, Moon, Kyoung-Sik, Tison, Christopher K.
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Study and Characterization on the Nanocomposite Underfill for Flip Chip Applications (2006)
Wong, C. P., Sun, Yangyang, Zhang, Zhuqing
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Wong, C. P., Li, Yi, Moon, Kyoung-Sik
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L. Hughes, Dr. F. Levent Degertekin, Dr. C. P. Wong, J. Summers, ...
To my mother for her unyielding support
PAPER www.rsc.org/materials | Journal of Materials Chemistry (2005)
Jiongxin Lu, Kyoung-sik Moon, Jianwen Xu, C. P. Wong
Synthesis and dielectric properties of novel high-K polymer composites containing in-situ formed silver nanoparticles for embedded capacitor applications
Novel Reworkable Fluxing Underfill for Board-Level Assembly (2004)
Wong, C. P., Zhang, Zhuqing, Li, Haiying
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Novel Reworkable Fluxing Underfill for Board-Level Assembly (2004)
Wong, C. P., Zhang, Zhuqing, Li, Haiying
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Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability (2004)
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Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability (2004)
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Modeling of the Curing Kinetics of No-Flow Underfill in Flip-Chip Applications (2004)
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Moisture Absorption in Uncured Underfill Materials (2004)
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Modeling of the Curing Kinetics of No-Flow Underfill in Flip-Chip Applications (2004)
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Moisture Absorption in Uncured Underfill Materials (2004)
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Next Generation of 100-um-Pitch Wafer-Level Packaging and Assembly for Systems-on-Package (2004)
Tay, Andrew, Iyer, Mahadevan, Tummala, Rao, Kripesh, V, Wong, E.H., Swaminathan, Madhavan, ...
According to the latest ITRS roadmap, the pitch of area array packages is expected to decrease to 100 um by 2009. Simultaneously, the electrical performance of these interconnections needs to be...
Next Generation of 100-μm-Pitch Wafer-Level Packaging and Assembly for Systems-on-Package (2004)
Wong, C. P., Kang, E. T., Tay, Andrew A. O., Wong, E. H., Swaminathan, Madhavan, Iyer, Mahadevan K., ...
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Next Generation of 100-um-Pitch Wafer-Level Packaging and Assembly for Systems-on-Package (2004)
Tay, Andrew, Iyer, Mahadevan, Tummala, Rao, Kripesh, V, Wong, E.H., Swaminathan, Madhavan, ...
According to the latest ITRS roadmap, the pitch of area array packages is expected to decrease to 100 um by 2009. Simultaneously, the electrical performance of these interconnections needs to be...
Next Generation of 100-um-Pitch Wafer-Level Packaging and Assembly for Systems-on-Package (2004)
Tay, Andrew, Iyer, Mahadevan, Tummala, Rao, Kripesh, V, Wong, E.H., Swaminathan, Madhavan, ...
According to the latest ITRS roadmap, the pitch of area array packages is expected to decrease to 100 um by 2009. Simultaneously, the electrical performance of these interconnections needs to be...
Next Generation of 100-μm-Pitch Wafer-Level Packaging and Assembly for Systems-on-Package (2004)
Wong, C. P., Kang, E. T., Tay, Andrew A. O., Wong, E. H., Swaminathan, Madhavan, Iyer, Mahadevan K., ...
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A Reworkable Epoxy Resin for Isotropically Conductive Adhesive (2004)
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A Reworkable Epoxy Resin for Isotropically Conductive Adhesive (2004)
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Wong, C. P., Zhang, Zhuqing, Sitaraman, Suresh K.
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Wong, C. P., Zhang, Zhuqing, Sitaraman, Suresh K.
©2004 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Solution Processing - Rodlike Polymers (2004)
Berry, G. C., Wong, C. P., Venkatramen, S., Chu, S. G.
The solution processing of polybenzoxazole (PBO) and polybenzthiozole (PBT) to form oriented solids is discussed. The rheological considerations important in solution processing are considered, with...
Dr. Madhavan Swaminathan Advisor, F. Peterson, R. Tummala, Dr. C. P. Wong, ...
Dedicated to My loving parents and family ACKNOWELEDGEMENTS I would like to thank many friends and supporters who have made this happen. First of all, I would like to thank professor Madhavan...
I would like to thank my advisor, Dr. Yogendra Joshi, for his guidance, encouragement and support during the course of this study at the University of Maryland College Park and Georgia Institute of...
CAD Tools and Algorithms (2004)
Chung-seok Seo, Dr. Madhavan Swaminathan, A. Buck, Dr. C. P. Wong, My Son, ...
Dedicated to
Resonator Methods, Madhavan Swaminathan Advisor, David C. Keezer, Abhijit Chatterjee, Sung Kyu Lim, C. P. Wong
for their love and support
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©2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Wong, C. P., Moon, Kyoung-Sik, Wu, Jiali
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Wong, C. P., Li, Haiying, Johnson, Ashanti
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Wong, C. P., Moon, Kyoung-Sik, Wu, Jiali
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Wong, C. P., Li, Haiying, Johnson, Ashanti
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Double-Layer No-Flow Underfill Materials and Process (2003)
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Double-Layer No-Flow Underfill Materials and Process (2003)
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Adhesion Evaluation on Low-Cost Alternatives to Thermosetting Epoxy Encapsulants (2003)
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Adhesion Evaluation on Low-Cost Alternatives to Thermosetting Epoxy Encapsulants (2003)
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Double-Layer No-Flow Underfill Process for Flip-Chip Applications (2003)
Zhang, Zhuqing, Lu, Jicun, Wong, C. P.
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An Improvement of Thermal Conductivity of Underfill Materials for Flip-Chip Packages (2003)
Wong, C. P., Li, Haiying, Jacob, Karl I.
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An Improvement of Thermal Conductivity of Underfill Materials for Flip-Chip Packages (2003)
Wong, C. P., Li, Haiying, Jacob, Karl I.
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Study on Underfill/Solder Adhesion in Flip-Chip Encapsulation (2002)
Wong, C. P., Fan, Lianhua, Tison, Christopher K.
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Study on Underfill/Solder Adhesion in Flip-Chip Encapsulation (2002)
Wong, C. P., Fan, Lianhua, Tison, Christopher K.
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Development of High Performance Interfill Materials for System Chips Technology (2002)
Wong, C. P., Wu, Jiali, Bhattacharya, Swapan, Lloyd, Courtney, Pogge, H. Bernhard, Tummala, Rao R.
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Development of New Low Stress Epoxies for MEMS Device Encapsulation (2002)
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Development of High Performance Interfill Materials for System Chips Technology (2002)
Wong, C. P., Wu, Jiali, Bhattacharya, Swapan, Lloyd, Courtney, Pogge, H. Bernhard, Tummala, Rao R.
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Development of New Low Stress Epoxies for MEMS Device Encapsulation (2002)
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Assembly of Lead-free Bumped Flip-Chip with No-Flow Underfills (2002)
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Assembly of Lead-free Bumped Flip-Chip with No-Flow Underfills (2002)
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Development of Environmental Friendly Non-Anhydride No-Flow Underfills (2002)
Wong, C. P., Zhang, Zhuqing, Fan, Lianhua
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©2002 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Development of Environmental Friendly Non-Anhydride No-Flow Underfills (2002)
Wong, C. P., Zhang, Zhuqing, Fan, Lianhua
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©2002 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Yang Rao, Jireh Yue, C. P. Wong
Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer–ceramic composites have been of great...
©2001 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Wong, C. P., Dunne, Rajiv Carl, Sitaraman, Suresh K., Luo, Shijian, Estes, William E., Periyasamy, Mookkan, ...
©2001 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
©2001 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Wong, C. P., Dunne, Rajiv Carl, Sitaraman, Suresh K., Luo, Shijian, Estes, William E., Periyasamy, Mookkan, ...
©2001 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Reworkable No-Flow Underfills for Flip Chip Applications (2001)
Wong, C. P., Wang, Lejun, Li, Haiying
©2001 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Reworkable No-Flow Underfills for Flip Chip Applications (2001)
Wong, C. P., Wang, Lejun, Li, Haiying
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Development of No-Flow Underfill Materials for Lead-Free Solder Bumped Flip-Chip Applications (2001)
Wong, C. P., Zhang, Z. Q., Shi, S. H.
©2001 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Effect of UV/Ozone Treatment on Surface Tension and Adhesion in Electronic Packaging (2001)
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Study on Effect of Coupling Agents on Underfill Material in Flip Chip Packaging (2001)
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Development of No-Flow Underfill Materials for Lead-Free Solder Bumped Flip-Chip Applications (2001)
Wong, C. P., Zhang, Zhuqing, Shi, Songhua
©2001 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Effect of UV/Ozone Treatment on Surface Tension and Adhesion in Electronic Packaging (2001)
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Study on Effect of Coupling Agents on Underfill Material in Flip Chip Packaging (2001)
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Development of Conductive Adhesives for Solder Replacement (2000)
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Development of Conductive Adhesives for Solder Replacement (2000)
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Wong, C. P., Wu, Jiali, Pike, Randy T., Kim, Namsoo P., Tanielian, Minas H.
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Wong, C. P., Wu, Jiali, Pike, Randy T., Kim, Namsoo P., Tanielian, Minas H.
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A Study of Contact Resistance of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems (2000)
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Wong, C. P., Rao, Yang, Shi, S. H.
©2000 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
A Study of Contact Resistance of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems (2000)
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Wong, C. P., Rao, Yang, Shi, Songhua
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Effective Elastic Modulus of Underfill Material for Flip-Chip Applications (2000)
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©2000 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Effective Elastic Modulus of Underfill Material for Flip-Chip Applications (2000)
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Separation of Low Molecular Siloxanes for Electronic Application by Liquid-Liquid Extraction (1999)
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Separation of Low Molecular Siloxanes for Electronic Application by Liquid-Liquid Extraction (1999)
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A Study of Lubricants on Silver Flakes for Microelectronics Conductive Adhesives (1999)
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A Study of Lubricants on Silver Flakes for Microelectronics Conductive Adhesives (1999)
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Novel Bi-Layer Conformal Coating for Reliability Without Hermeticity MEMS Encapsulation (1999)
Wong, C. P., Wu, Jiali, Pike, Randy T.
©1999 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives (1999)
Wong, C. P., Lu, Daoqiang, Tong, Quinn K.
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Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives (1999)
Wong, C. P., Lu, Daoqiang, Tong, Quinn K.
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Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA’s) (1999)
Wong, C. P., Lu, Daoqiang, Tong, Quinn K.
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Novel Bi-Layer Conformal Coating for Reliability Without Hermeticity MEMS Encapsulation (1999)
Wong, C. P., Wu, Jiali, Pike, Randy T.
©1999 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives (1999)
Wong, C. P., Lu, Daoqiang, Tong, Quinn K.
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Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA’s) (1999)
Wong, C. P., Lu, Daoqiang, Tong, Quinn K.
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Wong, C. P., Wong, Michelle M.
©1999 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Wong, C. P., Wong, Michelle M.
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Wong, C. P., Bollampally, Raja S.
©1999 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Novel Thermally Reworkable Underfill Encapsulants For Flip-Chip Applications (1999)
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Wong, C. P., Bollampally, Raja Sheker
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Novel Thermally Reworkable Underfill Encapsulants For Flip-Chip Applications (1999)
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Wong, C. P., Palaniappan, Prema, Baldwin, Daniel F., Selman, Paul J., Wu, Jaili
©1999 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Wong, C. P., Palaniappan, Prema, Baldwin, Daniel F., Selman, Paul J., Wu, Jiali
©1999 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Modeling of imbedded passive components (1999)
Wong, C. P., Rao, Yang, Qu, Jianmin
Issued as final report
Polymer Structures and Properties. Part II. Thermally Stable Polymers. (1998)
Berry, G. C., Casassa, E. F., Liwak, S. M., Wong, C. P., Goebel, K. D.
Viscoelastic studies on BBB to elucidate the mechanism by which deformation occurs and the relation between supramolecular structure and deformation are described. A tensile creep apparatus suitable...
Use of Compliant Adhesives in the Large Area Processing of MCM-D Substrates (1998)
Wong, C. P., Wu, Jiali, Pike, Randy T.
©1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Use of Compliant Adhesives in the Large Area Processing of MCM-D Substrates (1998)
Wong, C. P., Wu, Jiali, Pike, Randy T.
©1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Wong, C. P., Shi, Songhua H., Jefferson, G.
©1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Wong, C. P., Shi, Songhua, Jefferson, G.
©1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Fast-Flow Underfill Encapsulant: Flow Rate and Coefficient of Thermal Expansion (1998)
Wong, C. P., Vincent, Michael B., Shi, S.
©1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Fast-Flow Underfill Encapsulant: Flow Rate and Coefficient of Thermal Expansion (1998)
Wong, C. P., Vincent, Michael Brien, Shi, Songhua
©1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Wong, C. P., Palaniappan, Prema, Selman, Paul J., Baldwin, Daniel, Wu, Jaili
©1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Wong, C. P., Segelken, John M., Tai, K. L., Wong, C. C.
©1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Wong, C. P., Segelken, John M., Tai, K. L., Wong, C. C.
©1998 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Modeling of embedded passive components (1998)
Wong, C. P., Rao, Yang, Qu, Jianmin, Troutman, Tia Shawana
Issued as final report
Creatine kinase MB isoenzyme studies in diagnosis of myocardial infarction.
Smith, A F, Radford, D, Wong, C P, Oliver, M F
Serial measurements of the MB isoenzyme of creatine kinase, total creatine kinase, aspartate mainotransferase, and urea stable lactate dehydrogenase have been made in the serum of a series of 139...