Dongping Tian

3D Inspection on Wafer Solder Bumps Using Binary Grating Projection in Integrated Circuit Manufacturing (2006)

YUAN, Shu, TIAN, Dongping, ZENG, Yanxing

For the measurement of the 3D surface of micro-solderballs in IC (Integrated Circuit) manufacturing inspection, a binary grating project lenses of high MTF (Modulation Transfer Function) with tilted...

Glial Progenitor-Like Phenotype in Low-Grade Glioma and Enhanced CD133-Expression and Neuronal Lineage Differentiation Potential in High-Grade Glioma

Rebetz, Johan, Tian, Dongping, Persson, Annette, Widegren, Bengt, Salford, Leif G., Englund, Elisabet, ...

Analysis of iodine and selenium trace elements in umbilical cord blood in cretinous regions in northwest China in 1999

Su, Min, Tian, Dongping, Li, Wensheng, Zhao, Hu, Li, Liping, Tan, Wuhong, ...

Shaanxi Province located at Midwest inland of China was a typical iodine deficient disorders region. To investigate iodine and selenium levels of neonates in the Shaanxi sub-clinical cretinism region...