Micro-contact printing of OTFT on polymer foils (2009)
König, M., Bock, K., Klink, G.
In the emerging field of large area electronics polymer foil substrates play a key role in large area and flexible electronic, illumination and display systems. Compared to silicon, however, coatings...
Microfluidics on foil: State of the art and new developments (2008)
Velten, T., Schuck, H., Richter, M., Klink, G., Bock, K., Malek, C.K., ...
The concept of microfluidics on foil opens up new opportunities for combining the advantages of having a flexible substrate with reel-to-reel processing, which has the potential to be the basis for...
Plastic based system components and technology for (bio-)chemical sensors (2008)
(Bio-)chemical microsensors are widely used in process control, biotechnology, medicine and laboratory. For instance, currently electrochemical transducers are used for glucose detection, biochip...
Pulsed stress behavior of flexible thick film resistors (2008)
Bonfert, D., Wolf, H., Gieser, H., Klink, G., Bock, K., Svasta, P., ...
In order to investigate the behavior for very high current densities on polymer resistors on flexible substrates, a pulsed measurement technique was applied. The analytical test technique of...
Reliability of polymer electronics on plastic film (2008)
Klink, G., Strohhöfer, C., Bock, K.
Different working groups have already shown the possibilities of organic electronics for realization of low cost electronic circuits. In the mean time different technology demonstrators have been...
Elektrisch steuerbare Anzeigevorrichung mit elektrisch beheizbarer thermochromer Schicht (2007)
Yacoub-George, E., Klink, G., Seeboth, A.
DE 102006001487 A1 UPAB: 20070801 NOVELTY - The device (100) has a support layer (102) and a thermochrome layer (108) that has different optical characteristics at different temperatures. An electric...
Roll-to-roll microfabrication of polymer systems (2007)
Strohhöfer, C., Klink, G., Feil, M., Drost, A., Bollmann, D., Hemmetzberger, D., ...
Large area cost-efficient electronics systems integration (2007)
Bock, K., Klink, G., Strohhofer, C., Hemmetzberger, D., Feil, M.
Verfahren zur Herstellung von gemeinsam bereitstellbaren flexiblen integrierten Schaltkreisen (2006)
Klink, G., Landesberger, C., Feil, M.
DE 102006044525 B3 UPAB: 20080310 NOVELTY - The method involves continuous making of a flexible substrate (120) having a conductive strip structure (130). The flexible integrated circuit (140) is...
Studies of fine pitch patterning by reel-to-reel processes for flexible electronic systems (2005)
Drost, A., Klink, G., Feil, M., Bock, K.
Cost effective and high quality processes are needed for further development of flexible electronic systems. Applications of these structures are e. g. in the field of high density interconnection...
Reel-to-reel manufacturing of integrated circuits based on soluble polymer semiconductor (2005)
Klink, G., Hammerl, E., Drost, A., Hemmetzberger, D., Bock, K.
Within this work a process for manufacturing integrated circuits based on solution processed polymer semiconductors has been developed. Basis is a reel-to-reel working photolithographic patterning...
Reel-to-reel manufacturing of polymer electronics for low-cost applications (2004)
Polymer electronics is expected as an additional technology for flexible systems, which can not be reached by common semiconductor industry due to cost reasons. Advantageous use of polymer circuits...
Polytronics: Technology trends and environmental issues (2004)
Bock, K., Burghart, M., Klink, G., Pötter, H., Müller, J., Hagelüken, M.
Evaluation of reel-to-reel processes for polymer electronics (2003)
Burghart, M., Liemann, G., Klink, G., Bock, K.
In this work reel-to-reel processes for polymer devices have been investigated. Reel-to-reel fabrication differs from wafer processing, commonly used for research in organic devices mainly in two...
Polymerelektronik - Ziele und Entwicklungen (2003)
Klink, G., Burghart, M., Bock, K.
In jüngster Zeit werden zunehmend die Eigenschaften moderner Polymere auch als Funktionsmaterial ausgenutzt. Möglich wurde dies durch die Entdeckung und Entwicklung halbleitender und leitender...
Verfahren zur Montage eines Chips auf einem Substrat (2003)
DE 10151657 C UPAB: 20030312 NOVELTY - Process for assembling a chip with contacts on a substrate comprises applying adhesion agent points (8) made from conducting adhesive on the contacts on the...
Feil, M., Adler, C., Klink, G., König, M., Landesberger, C., Scherbaum, S., ...
Ultra thin chips with a thickness below 30µm offer low system height, low topography and show enhanced mechanical flexibility. These properties enable diverse use possibilities and new applications....
Entwicklungen in der Smart Label Technologie (2002)
Smart Label besitzen gegenüber anderen maschinenlesbaren Systemen wie dem Barcode mehrere Vorteile (keine Sichtverbindung, Beschreibbarkeit, Simultanlesen). Allerdings sind die Kosten für derartige...
Reliability of thinned silicon ICs (2002)
Landesberger, C., Bollmann, D., Klink, G., Bock, H., Reichl, H.
Ultra thin ICs will play an important role in future packaging applications for smart and flexible systems. Thinned silicon gets more and more mechanically flexible with thickness below 50 µm and...
Fast Flip Chip Assembly for Reel-to-Reel Manufacturing (2001)
König, M., Klink, G., Feil, M.
For low-cost applications like smart labels a mounting technology, which allows high throughput, is necessary. Therefore such products are fabricated reel-to-reel on flexible substrates. With this...
Innovative packaging concepts for ultra thin integrated circuits (2001)
Klink, G., Feil, M., Ansorge, F., Aschenbrenner, R., Reichl, H.
The increasing demand on miniaturized and flat packaging technologies is driven by the trend towards small and portable electronic systems. Due to the requirements of modern Ball Grid Arrays, Smart...
Interconnection Techniques for Ultra Thin ICs and MEMS Elements (2001)
Feil, M., Adler, C., Klink, G., König, M.
By advanced wafer thinning technologies integrated circuits with a thickness below 50µm can be fabricated. These very thin chips offer low system height and topography and show enlarged mechanical...
Paper-thin ICs for Future Smart Label Applications (2001)
One of the most growing markets for integrated circuits is the area of electronic tags, tickets and labels. These products will be the beginning of an emerging market of throwaway electronics, which...
New dicing and thinning concept improves mechanical reliability of ultra thin silicon (2001)
Landesberger, C., Klink, G., Schwinn, R., Aschenbrenner, R.
Ultra thin silicon ICs with a remaining thickness of less than 30 µm are investigated with respect to their manufacturing technology and mechanical behavior. Thin wafers which were diced using a...
Ultra Thin ICs Open New Dimensions for Microelectronic Systems (2000)
Klink, G., Landesberger, C., Feil, M., Ansorge, F., Aschenbrenner,R.
With advanced wafer thinning technology ultra thin and mechanically flexible integrated circuits can be manufactured. These chips can be used in a growing number of innovative applications. This...
Process Evaluation of Advanced Thick Film Techniques for RF-Applications (2000)
Klink, G., Richter, H., Feil, M.
For fabrication of RF-circuits different suppliers offer new thick-film materials with line resolutions formerly reserved to thin film technology. One of these materials the gold paste KQ 500...
Investigations on Fine Line Patterning of Advanced Thick Film Paste (2000)
Klink, G., Richter, H., Feil, M.
Current developments in microelectronics show the ongoing trend to further miniaturisation. This trend will move more packaging applications to substrates with wiring densities in the region of...
Assembly of Ultra Thin and Flexible ICs (2000)
Adler, C., Klink, G., Feil, M., Ansorge, F., Reichl, H.
The Fraunhofer Institute for Reliability and Microintegration in Munich has developed a process for manufacturing ultra thin ICs with a thickness down to 10 5m. These very thin ICs offer several...
BUSCA: A Telescope Instrumentation for Simultaneous Imaging in 4 Optical Bands (1999)
Reif, K., Bagschik, K., De Boer, K. S., Schmoll, J., Mueller, Ph., Poschmann, H, ...
The "Bonn University Simultaneous CAmera" (BUSCA) is a CCD camera system which allows simultaneous direct imaging of the same sky area in four colors. The optics are designed for an f/8 beam and four...
Wafer bonding with an adhesive coating (1998)
The assembly process for microelectromechanical systems often requires a wafer-joining process using low temperatures. In this work a bonding process is investigated, which uses thin adhesive films...
Thin-film processing on a thick-film multilayer (1998)
Klink, G., Drost, A., Schmaus, C., Bechtold, F., Feil, M.
Spin-on and lithography steps in thin-film processing require planar and smooth surfaces. Usually ceramic substrates with as-fired surface roughness of R(a)
Simultaneous fabrication of dielectric and electrical joints by wafer bonding (1998)
Drost, A., Klink, G., Scherbaum, S., Feil, M.
Wafer bonding is a key technology for the fabrication of micro mechanical systems which consist of two or more stacked silicon parts. Among the different bonding methods anodic bonding with an...
Kluge, S., Klink, G., Woias, P.
In this contribution we present an electrostatically actuated microvalve to be used both as a pneumatic switch and as a gas flow regulator. The normally open 2/2-way valve consists of two...
Verfahren zum Verbinden von mikromechanischen Wafern (1997)
The method involves joining surfaces of protruding structures on the main surface of the wafer to a second wafer using an intermediate carrier with an adhesive layer on its main surface. The first...
Kombination von Dünnfilm- und Dickschichttechnik (1997)
Klink, G., Schmaus, C., Bechtold, F., Feil, M.
Dünnfilm- und Dickschichttechnik sind etablierte Technologien zur Herstellung von hybriden Schaltungsträgern. Vorteile von Dickschichthybriden sind die Fertigbarkeit in hohen Stückzahlen und die...
Full-wafer mounting technologies for silicon micropumps (1997)
Linnemann, R., Richter, M., Kluge, S., Klink, G., Landesberger, C., Woias, P.
Zuverlässigkeit in der Mikrosystemtechnik - Methoden, Verfahren, Grenzen (1992)
Bei der Entwicklung elektornischer Bauteile wird es zunehmend wichtiger bereits während der Entwicklungsphase Zuverlässigkeitsaspekte zu berücksichtigen. Insbesondere gilt dies für...