H. Boutry

Publication List Details

Period

2002 - 2009

Number

2

Co-Authors

Reliability characterization and process optimization of Ni-based microinsert interconnections for flip chip die on wafer attachment (2009)

Boutry, H., Brun, J., Nowodzinski, A., Sillon, N., Depoutot, F., Dubois-Bonvalot, B., ...

In many complex systems under development, the cost of integration and the compromises in performance that can result from the integration process can become prohibitive. Therefore, the establishment...

Long dephasing time and high temperature ballistic transport in an InGaAs open quantum dot (2002)

Hackens, B., Faniel, S., Delfosse, F., Gustin, C., Boutry, H., Huynen, I., ...

We report on measurements of the magnetoconductance of an open circular InGaAs quantum dot between 1.3K and 204K. We observe two types of magnetoconductance fluctuations: universal conductance...