Molecular Dynamics Study of Thermal Properties of Intermetallic Alloys (2008)
Molecular dynamics simulations of bulk copper, gold pure metals and their ordered intermetallics alloys of Cu3Au(L12) andCuAu3(L12) havebeencarriedoutbetweenabove0Kandbelowthetheir melting points of...
Mechanical and electronical properties of ZnS under pressure (2008)
M. Bilge, S. Özdemir Kart, H.H. Kart, T. Cagin
Purpose: The wide-gap semiconductor materials are very important for application in the fields of optical device technology. ZnS is wide-gap semiconductor that is attractive material due to the...
Purpose: Impurity atoms in the grain boundary can be responsible for embrittlement or they can strengthen a material. In this work, we have modeled the effect of B impurity on ∑ 5 (012) symmetrical...