Biomolecular self-assembly of micrometer sized silica beads on patterned glass substrates (2009)
Alberti, M., Yacoub-George, E., Hell, W., Landesberger, C., Bock, K.
A self-assembly process for the two-dimensional arrangement of micrometer sized silica beads on glass slides was developed. It is based on the hybridization of two single stranded...
Micro-contact printing of OTFT on polymer foils (2009)
König, M., Bock, K., Klink, G.
In the emerging field of large area electronics polymer foil substrates play a key role in large area and flexible electronic, illumination and display systems. Compared to silicon, however, coatings...
Electrostatic carrier technique for thin wafer processing (2009)
Landesberger, C., Wieland, R., Ramm, P., Bock, K.
Mobile electrostatic carriers enable secure handling and processing of thin semiconductor substrates. Application of e-carriers as a reversible support system at temperatures up to 400 °C has been...
Pulsed behavior of polymer protection devices (2009)
Bonfert, D., Gieser, H., Bock, K., Svasta, P., Ionescu, C.
Polymer protection devices are placed on circuit boards as chip devices to protect existing electronic devices from electrostatic discharge events (ESD). As there are no generally accepted standards...
Plastic based system components and technology for (bio-)chemical sensors (2008)
(Bio-)chemical microsensors are widely used in process control, biotechnology, medicine and laboratory. For instance, currently electrochemical transducers are used for glucose detection, biochip...
Selective one-step plasma patterning process for fluidic self-assembly of silicon chips (2008)
Bock, K., Scherbaum, S., Yacoub-George, E., Landesberger, C.
Applying a tetrafluoromethane (CF4) low pressure plasma process to the surface of a polymeric foil with a structured thin film copper layer on top results in an opposed wettability behavior of metal...
Pulsed stress behavior of flexible thick film resistors (2008)
Bonfert, D., Wolf, H., Gieser, H., Klink, G., Bock, K., Svasta, P., ...
In order to investigate the behavior for very high current densities on polymer resistors on flexible substrates, a pulsed measurement technique was applied. The analytical test technique of...
Reliability of polymer electronics on plastic film (2008)
Klink, G., Strohhöfer, C., Bock, K.
Different working groups have already shown the possibilities of organic electronics for realization of low cost electronic circuits. In the mean time different technology demonstrators have been...
Schönfelder, S., Ebert, M., Landesberger, C., Bock, K., Bagdahn, J.
Thin silicon offers a variety of new possibilities in microelectronical, solar and micromechanical industries, e.g. for 3D-integration (stacked dies), thin microelectromechanical packages or thin...
Carrier techniques for thin wafer processing (2007)
Landesberger, C., Scherbaum, S., Bock, K.
Three different types of carrier techniques have been investigated and developed: thermal release tapes, solvable thermoplastic glue layer and mobile electrostatic carrier. These carriers were...
Schönfelder, S., Ebert, M., Landesberger, C., Bock, K., Bagdahn, J.
Thin silicon offers a variety of new possibilities in microelectronical, solar and micromechanical industries, e.g. for 3D-integration (stacked dies), thin microelectromechanical packages or thin...
The functions of structural priming (2006)
Structural priming refers to speakers' tendency to produce sentences with previously heard or produced syntactic structures. We review arguments and evidence for three common accounts of the...
Verfahren zum Herstellen einer Leiterstruktur auf einem Substrat (2006)
DE 102005016511 A1 UPAB: 20061218 NOVELTY - The method involves providing a conductive base material (10), and a substrate material (14). The material (10) is stamped by a rolling die to obtain a...
Investigations of strength properties of ultra-thin silicon (2005)
Schönfelder, S., Bagdahn, J., Ebert, M., Petzold, M., Bock, K., Landesberger, C.
Thin silicon offers a variaty of new possibilities in microelectronical and micromechanical industries, e.g. for 3D-integration (stacked dice) or optoelectronic components (LED). The thin wafers are...
DE 10325559 B UPAB: 20041223 NOVELTY - A production of a system involves producing a liquid volume (16) containing a component (18) and applying the liquid volume containing the component onto the...
Current trends in the development of electronic systems show, that the provision of thin flexible components and semiconductors plays a decisive role in the steadily progressing development of highly...
Bock, K., Landesberger, C., Bleier, M., Bollmann, D., Hemmetzberger, D.
Mobile electrostatic carriers enable secure and reversible attachment of very thin semiconductor wafers by electrostatic forces which are induced by a permanent polarization state of a dielectric...
Verbundvorrichtung und Verfahren zur Herstellung derselben (2003)
WO2003060995 A UPAB: 20030903 NOVELTY - Production of a bonding device comprises: (1) preparing a first component on which a first molecule is applied,and a second component on which a second...