Switchable polymer-based thin film coils as a power module for wireless neural interfaces (2007)
Kim, S., Zoschke, K., Klein, M., Black, D., Buschick, K., Toepper, M., ...
Stackable thin film multi layer substrates with integrated passive components (2006)
Zoschke, K., Buschick, K., Scherpinski, K., Fischer, T., Wolf, J., Ehrmann, O., ...
Töpper, M., Klein, M., Buschick, K., Glaw, V., Orth, K., Ehrmann, O., ...
Flexible circuit carrier with integrated passives for high density integration (2004)
Fischer, T., Zoschke, K., Scherpinski, K., Buschick, K., Ehrmann, O., Wolf, M.J., ...
Autarke verteilte Mikrosysteme stellen durch ihre Kompaktheit eine besondere Herausforderung an die Aufbau- und Verbindungstechnik. Durch die Anforderung, eine Systemintegration in einem definierten...
Krabe, D., Lang, G., Springer, A., Hagenbuechle, M., Buschick, K., Ehrmann, O., ...
WO 200002247 A UPAB: 20000330 NOVELTY - The method involves mounting the components (3) outside the carrier body (4) in a plane approximately parallel to the carrier body surface. Components are...
Dielektrika auf Polybenzoxazol-Basis für MCM- und On-Chip-Applikationen (1999)
Sezi, R., Maltenberger, A., Radlik, W., Schmid, G., Weber, A., Buschick, K., ...
Positiv strukturierbare photosensitive Polybenzoxazole, die für die Verwendung in Multichipmodulen (MCM) entwickelt wurden, zeigen eine hohe Auflösung und geringe Defektdichte. Im Vergleich zu...
Baur, M., Schumm, T., Wertheimer, R., Schanz, M., Eckart, T., Nitta, C., ...
Im vorliegenden Beitrag wird ein hochsprachenprogrammierbares System zur schritthaltenden Vollbild-Interpretation natürlich beleuchteter Szenenfolgen im Videotakt vorgestellt. Im einzelnen werden...
System Integration for High Frequency Applications (1998)
Töpper, M., Wolf, J., Schmückle, F.J., Heinrich, W., Buschick, K., Owzar, A., ...
Thin film multilayer substrate technology with dielectric polymer layers and sputtered/electroplated wiring provide the highest line density per layer and therefore they are of special interest for...
Shear test for adhesion measurement of small structures (1997)
Schammler, G., Buschick, K., Hahn, R., Reichl, H.
In this study adhesion measurements using shear testing and investigation of the failure mode were carried out. We determined the average shear force of small polyimide structures on metal or oxide...
Multichip-modules for high frequency applications (1997)
Wolf, J., Schmückle, S.J., Owzar, A., Töpper, M., Buschick, K., Reichl, H.
Thinfilm multilayer substrate technology with dielectric polymer layers and sputtered/electroplated wiring system provide the highest line density per layer and therefore they are of special interest...
Laser machining of ceramics for MCM-D applications (1997)
Glaw, V., Hahn, R., Wolf, J., Töpper, M., Buschick, K., Hein, U., ...
High performance cooling technology for Multi Chip Modules (MCM-D) with planar embedded dice (1997)
Hahn, R., Töpper, M., Schmidt, M., Kamp, A., Ginolas, A., Wolf, J., ...
Multichip modules (MCMs) offer significant reduction in both interconnection signal delay and microelectronics packaging volume. However, this integration results in higher heat flux densities in the...
Embedding technology - a chip-first approach using BCB (1997)
Töpper, M., Buschick, K., Wolf, J., Glaw, V., Hahn, R., Dabek, A., ...
With the current trend to ever faster clock rates the propagation delays between the chips constitute a significant portion of the clock cycle. Mounting both active and passive devices as closely...
Elektrische Verbindungen in hochdichter Rasteranordnung (1997)
Electrically conducting connection between a first and a second boundary surface of a substrate (8) of an electronic switch with several leads (3) electrically insulated from each other is claimed....
Fabrication of high power MCMs by planar embedding technique and active cooling (1996)
Töpper, M., Hahn, R., Wolf, J., Glaw, V., Buschick, K., Hoehne, J., ...
This paper descibes the planar embedding technique for the fabrication of high power mulitchip modules (MCM-D). A back side planarizing process was developed which allowed a low thermal resistivity...
MCM-D with embedded active and passive components (1996)
Töpper, M., Wolf, J., Glaw, V., Buschick, K., Dabek, A., Dietrich, L., ...
A planar integration technology of bare dice together with passive SMDs embedded in ceramic substrates to yield a high-dense MCM-D is presented. The components are inserted into premanufactured...