Chemical mechanical planarization (CMP) metrology for 45/32 nm technology generations (2007)
In-plane geometrical defects on wafer surfaces following Chemical Mechanical Planarization (CMP) processing in the lateral millimeter range and in vertical dimensions in the nanometer range are of...
Detection and review of crystal originated surface and sub surface defects on bare silicon (2007)
Nutsch, A., Funakoshi, T., Pfitzner, L., Steffen, R., Supplieth, F., Ryssel, H.
The continuous dimensional reduction for micro-and nano electronics is driving the technology for yield relevant defect detection. Defects originating in the crystal are always present in silicon...
Control of flatness for chemical mechanical planarization (2007)
To measure and control the topography of wafer surfaces at nanometer scale is essential for semiconductor manufacturing. Flatness control of chemical mechanical planarization requires compact...
Metrology, analysis and characterization in micro- and nanotechnologies: A European Challenge (2007)
Pfitzner, L., Nutsch, A., Öchsner, R., Pfeffer, M., Don, E., Wyon, C., ...
Europe offers excellent expertise in the area of metrology, analysis and characterization in micro- and nanotechnologies. This exper-tise is borne through research institutes, academia, small/medium...
Standardization of integrated ellipsometry for semiconductor manufacturing (2006)
Roeder, G., Schellenberger, M., Pfitzner, L., Ryssel, H., Richter, U., Stehle, J.L., ...
Prospects for the realization of APC in a distributed 300 mm R&D-line (2006)
Roeder, G., Schellenberger, M., Öchsner, R., Pfeffer, M., Frickinger, J., Pfitzner, L., ...
Öchsner, R., Frickinger, J., Pfeffer, M., Schellenberger, M., Roeder, G., Pfitzner, L., ...
This paper describes the objectives and results of a joint European project named FLYING WAFER. The goal of the project was to provide a methodology for interlinking European R&D centers in micro-...
Creation of e-learning content for microelectronics manufacturing (2006)
Öchsner, R., Pfeffer, M., Pfitzner, L., Ryssel, H., Beer, K., Boldin, M., ...
In this paper, we report on the methodology, approach, and results concerning the creation of e-learning content for microelectronics manufacturing. The work was done in the framework of an EC-funded...
Creation of e-learning content for microelectronics manufacturing (2006)
Öchsner, R., Pfeffer, M., Pfitzner, L., Ryssel, H., Beer, K., Boldin, M., ...
In this paper, we report on methodology, approach, and results concerning the cr eation of e-learning content for microelectronics manufacturing. The work was d one in the framework of an EC-funded...
Unit process aspects for APC-software implementation (2005)
Roeder, G., Schellenberger, M., Pfitzner, L., Ryssel, H., Spitzlsperger, G.
Qualitaetsueberwachung bei einer Fertigung mit breitem Produktspektrum (2004)
Oechsner, R., Tschaftary, T., Strzyzewski, P., Pfitzner, L., Schneider, C., Hennig, P.
WO 200042480 A UPAB: 20001102 NOVELTY - Following processing in the S1 workstation, a spot sample is taken of the product. It is one of a series, having a first model number. Instruments measure set...
Effective-medium model for fast evaluation of scatterometric measurements on gratings (2004)
Weidner, A., Slodowski, M., Halm, C., Schneider, C., Pfitzner, L.
Scatterometry is now an accepted technique for linewidth measurement in semiconductor manufacturing. To reduce the evaluation time when using real-time optimization procedures, we introduce an...
Polierverfahren in der Halbleiterfertigung (2004)
Pfitzner, L., Bär, E., Frickinger, J., Nguyen, H., Nutsch, A.
E-Learning for microelectronics manufacturing (2004)
Oechsner, R., Pfeffer, M., Pfitzner, L., Ryssel, H., Beer, K., Boldin, M.
In this paper, we report on an EC-funded project concerning the creation of content for e-learning for microelectronics manufacturing. The project E-LIMM (E-L earning for Microelectronics...
Trunk, R., Schmid, H., Schneider, C., Pfitzner, L.
US2003041969 A UPAB: 20030619 NOVELTY - Two measuring instruments respectively measure concentration and parameter of particles in gaseous or liquid medium output from a feed connection. A control...
Wafer reclaim in semiconductor manufacturing (2003)
Frickinger, J., Nutsch, A., Pfitzner, L., Ryssel, H., Zielonka, G.
From overall equipment efficiency (OEE) to overall Fab effectiveness (OFE) (2002)
Oechsner, R., Pfeffer, M., Pfitzner, L., Binder, H., Müller, E., Vonderstrass, T.
The metrics of the SEMI standard E79 offers a good method to calculate the overall equipment efficiency (OEE) and finds increasing application and acceptance in the semiconductor industry. To...
Phi-scatterometry for integrated linewidth and process control in DRAM manufacturing (2002)
Hettwer, A., Benesch, N., Schneider, C., Pfitzner, L., Ryssel, H.
A cost-effective scatterometry method is presented that is suited for integrated pattern and process control and is valuable as a supplement to conventional SEMs. The phi-scatterometry procedure is...
HandMon-ISPM: Handling monitoring in a loading stations of a furnaces (2002)
Trunk, R., Schmid, H., Schneider, C., Pfitzner, L., Ryssel, H., Bernhardt, H., ...
Scratching wafers coated with the commonly used layer materials in semiconductor processing generates a significant large number of particles during loading or unloading with a misaligned handling...
In Situ Particle Measurement System in Loading Stations of Furnaces (2001)
Trunk, R., Schmid, H., Schneider, C., Pfitzner, L., Ryssel, H., Bernhardt, H., ...
In-situ particle measurement in loading stations of furnaces (2001)
Trunk, R., Schneider, C., Pfitzner, L., Ryssel, H., Storbeck, O.
Cost reduction strategies for wafer expenditure (2001)
Pfitzner, L., Benesch, N., Öchsner, R., Schmidt, C., Schneider, C., Tschaftary, T., ...
Development of sensors for the measurement of chamber wall depositions (2001)
Schneider, C., Pfitzner, L., Ryssel, H., Marx, E., Schneider, T.
Ziel: Ziel dieses Teilprojektes war die Entwicklung und der Test von Sensoren zur Messung der Schichtdicke von dielektrischen Kammerwandbelegungen. Mit der Kenntnis der aktuellen Schichtdicke kann...
Integrated metrology. An enabler for advanced process control (APC) (2001)
Schneider, C., Pfitzner, L., Ryssel, H.
Advanced process control (APC) techniques become more and more important as short innovation cycles in microelectronics and a highly competitive market requires cost-effective solutions in...
Organic Contamination Workshop 2001. Proceedings (2001)
Pfitzner, L., Bügler, J., Frickinger, J.
Organic airborne molecular contamination in semiconductor device manufacturing has gained importance in the last few years. Although studies on the influence of organic contamination on certain...
Control of organic contamination in CMOS manufacturing (2001)
Bügler, J., Frickinger, J., Zielonka, G., Pfitzner, L., Ryssel, H., Schottler, M.
Trace analysis for 300 mm wafers and processes with total- reflection x-ray-fluorescence (2001)
Nutsch, A., Erdmann, V., Zielonka, G., Pfitzner, L., Ryssel, H.
Organic airborne molecular contamination in semiconductor device manufacturing has gained importance over the last few years. With steadily shrinking device geometries, with the introduction of...
In-production monitoring and control of in situ-chamber clean processes (2000)
Roeder, G., Andrian-Werburg, M. Von, Tschaftary, T., Schneider, C., Pfitzner, L., Ryssel, H., ...
Phi-scatterometry for on-line process control (2000)
Benesch, N., Hettwer, A., Schneider, C., Pfitzner, L., Ryssel, H., Broermann, O., ...
Feed-forward control for a lithography/etch sequence (2000)
Öchsner, R., Tschaftary, T., Sommer, S., Pfitzner, L., Ryssel, H., Gerath, H., ...
Feed-forward and feedback control are used to compensate for variations caused by processes or equipment. The variations may be due to e.g. aging or shift and they may occur within a single process...
Benesch, N., Schneider, C., Pfitzner, L.
DE 19922614 A UPAB: 20000807 NOVELTY - The method involves providing reference signatures of fine structure surfaces. At least one signature of a sample surface to be controlled is measured and...
SEMICON Europa 2000. Proceedings (2000)
Organic airborne molecular contamination in semiconductor device manufacturing has gained importance over the last few years. With steadily shrinking device geometries, with the introduction of...
Verfahren und Vorrichtung zur Ueberfuehrung eines Fluessigkeitsstromes in einen Gasstrom (2000)
Strzyzewski, P., Roeder, G., Pfitzner, L., Ryssel, H.
In a process and a device for the transfer of a liquid stream into a gas stream, a liquid stream is brought to an evaporation volume, the liquid stream is dispersed in order to increase the liquid...
Novel process control strategies for 300 mm semiconductor production (1999)
Pfitzner, L., Oechsner, R., Schneider, C., Ryssel, H., Riemer, M., Podewils, M. Von
Semiconductor industry is one of the fastest growing businesses. Integrated circuit production process is becoming more and more challenging as the increase in complexity and in wafer size continues....
Application and cost analysis of scatterometry for integrated metrology (1999)
Benesch, N., Schneider, C., Pfitzner, L., Ryssel, H.
In semiconductor manufacturing there is a great demand for innovations towards higher cost-effectiveness. The increasing use of integrated metrology is one means to improve manufacturing processes...
Equipment and wafer modeling of batch furnaces by neural networks (1999)
Benesch, N., Schneider, C., Lehnert, W., Pfitzner, L., Ryssel, H.
In semiconductor manufacturing there is a great demand for innovations towards higher cost-effectiveness. The increasing employment of advanced control systems for process and equipment control is...
Ryssel, H., Pfitzner, L., Trunk, R.
The subject of the Productronica Workshop ¯Semiconductor Equipment and Materials® in Munich 1997 was contamination control and defect reduction. They are one of the key issues of semiconductor...
In situ spectroscopic ellipsometry for advanced process control in vertical furnaces (1998)
Lehnert, W., Berger, R., Schneider, C., Pfitzner, L., Ryssel, H., Stehle, J.L., ...
For the first time, a spectroscopic ellipsometer (SE) has been integrated into a vertical furnace to use it as an in situ layer thickness sensor. An SE was selected because of its high accuracy and...
In situ layer characterization by spectroscopic ellipsometry at high temperatures (1998)
Lehnert, W., Petrik, P., Schneider, C., Pfitzner, L., Ryssel, H.
Kasko, I., Oechsner, R., Schneider, C., Pfitzner, L., Ryssel, H., Trubitsyn, A.A., ...
A novel XPS system was developed and used for in-line control of silicon wafer cleaning. Unlike the conventional XPS systems where the electron energy analyzer and x-ray source are mounted on...
Monitoring strategies for yield enhancement (1997)
Pfitzner, L., Oechsner, R., Scheider, C., Ryssel, H., Riemer, M., Treiber, T., ...
Semiconductor manufacturing is driven by the necessity to increase productivity. Higher productivity can be achieved by an increase in throughput, by an increase in yield per wafer, by improvements...
Modular metrology tools for productivity enhancement in wafer fabs (1997)
Schneider, C., Pfitzner, L., Ryssel, H.
Integrated metrology helps to reduce costs by decreasing the number of monitor wafers and by reducing the risk of wafer loss. For these reasons, there is an increasing demand for solutions which help...
Metrology and analytics for the optimization of CMP processing (1997)
Huber, A., Erdmann, V., Zielonka, G., Schneider, C., Pfitzner, L., Ryssel, H., ...
The combination of various polishing and machine parameters and their interaction with consumables (e.g. polishing pad, slurry) requires thickens measurements of chemical mechanically polished...
Integrated process control for cluster tools using an in-line analytical module (1997)
Kasko, I., Oechsner, R., Froeschle, B., Schneider, C., Pfitzner, L., Ryssel, H.
The paper describes a novel analytical module for in-line process control in cluster tools. Having standardized mechanical and control interfaces (SEMI MESC/CTMC), the module can be easily attached...
Advanced process control system for vertical furnaces (1996)
Berger, R., Schneider, C., Lehnert, W., Pfitzner, L., Ryssel, H.
Applications of single-beam photothermal analysis (1994)
Schork, R., Krügel, S., Schneider, C., Pfitzner, L., Ryssel, H.
Thermal wave techniques have gained increasing attention in semiconductor process control because they are nondestructive and noncontacting. Recently, in-line and in situ implementations have been...
Applications of single-beam photothermal analysis (1994)
Schork, R., Krügel, S., Schneider, C., Pfitzner, L., Ryssel, H.
Thermal wave techniques have gained increasing attention in semiconductor process control because they are nondestructive and noncontacting. Recently, in-line and in situ implementations have been...
Applications of single-beam photothermal analysis (1994)
Schork, R., Krügel, S., Schneider, C., Pfitzner, L., Ryssel, H.
Thermal wave techniques have gained increasing attention in semiconductor process control because they are nondestructive and noncontacting. Recently, in-line and in situ implementations have been...
Schork, R., Krügel, S., Schneider, C., Pfitzner, L., Ryssel, H.
It was demonstrated in this paper that thermal wave analysis is capable of measuring two major parameters in the metallization processes of semiconductor manufacturing, metal layer thickness and...
Sicherheit bei Halbleiterfertigungsgeräten (1990)
Streckfuß, N., Pfitzner, L., Ryssel, H., Ryzlewicz, C.
Sicherheit ist ein heute recht oft verwendetes Schlagwort. Häufig versteht man darunter, je nach Standpunkt, etwas ganz anderes. Bei Halbleiterfertigungsgeräten kann man "Sicherheit" im...
Untersuchungen über Regelparameter in einer Lithographiezelle (1990)
Pfitzner, L., Ryssel, H., Temmel, G., Zielonka, G.
Lithography clusters with on-line processing will be used for critical exposure steps. Spin coating optimization for ultraplanarized single/multi -layer resists are, therefore, a prerequisit for...
Meßtechnik und Analytik für Halbleiterfertigungsgeräte (1990)
Eichinger, P., Pfitzner, L., Ryssel, H., Schneider, C.
Future generations of semiconductor devices require lower tolerances in manufacturing and, therefore, improved epuipment with in situ and on-line measurement and control systems for improved process...
Prozeßtechnische Aspekte fortschrittlicher Halbleiterfertigungsgeräte (1989)
Pfitzner, L., Ryssel, H., Schmutz, W.
Für die moderne Mikroelektronik ist die Frage der optimalen Fertigungsverfahren in vieler Hinsicht noch ungelöst. Mit der Entwicklung der nächsten IC-Generationen wie dem 16-Mbit- und dem...
International process control and automation for semiconductor manufacturing equipment (1989)
Pfitzner, L., Ryssel, H., Schneider, C.
Tighter tolerances in semiconductor manufacturing require reproducible processes. One of the most important steps towards improved processes is the integration of control and measurement systems into...
Internal process control and automation for semiconductor manufacturing equipment (1989)
Pfitzner, L., Ryssel, H., Schneider, C.
Increasing complexity of integrated circuits, shrinking geometries, and a larger number of critical processing steps require tighter tolerances of the process steps in semiconductor production....