A bulk tungsten divertor row for the outer strike point in JET (2009)
Mertens, Ph., Altmann, H., Hirai, T., Knaup, M., Neubauer, O., Philipps, V., ...
In the frame of the ITER-like wall project, a new row of divertor tiles has been developed which consists of 96 bulk tungsten load-bearing septum replacement plates (LB-SRP). Exposed to the outer...
A Market Based Measure of Credit Quality and Banks' Performance During the Subprime Crisis (2009)
We propose a new method for measuring the quality of banks credit portfolios. This method makes use of information impounded in bank share prices by exploiting differences in their sensitivity to...
A Market Based Measure of Credit Quality and Banks' Performance During the Subprime Crisis (2009)
We propose a new method for measuring the quality of banks' credit portfolios. This method makes use of information impounded in bank share prices by exploiting differences in their sensitivity to...
Recent laser shock-wave experiments by Da Silva et al. [1] with deuterium in a regime where a plasma phase-trasition has been predicted [5] are topic of many current discussions (e.g. [2, 3, 4]). In...
Wave Packet Molecular Dynamics Simulations of Hydrogen under Extreme Conditions (2007)
M. Knaup, G. Zwicknagel, C. Toepffer, Physik Ii
With the aid of \Wave Packet Molecular Dynamics" (WPMD) simulations we investigate hydrogen under extreme conditions. In this model the protons are treated as classical point-particles, whereas...
Knechtel, R., Knaup, M., Bagdahn, J.
In this paper a test structure is introduced, which allows the evaluation of the quality of an anodic bond interface in terms of surface energy. It is based on the creation of small non-bonded areas...
Strength analysis of etched silicon pressure sensors (2005)
Ebert, M., Knaup, M., Stelzer, T., Bagdahn, J., Bartuch, H., Brokmann, G.
The strength of relative pressure sensors are experimentally and numerically investigated. The sensors are produced with different eching processes and have different sizes because of different...
NON-destructive strength testing of anodic bonded glass-silicon wafer compounds (2005)
Knechtel, R., Knaup, M., Bagdahn, J., Wiemer, M.
In this paper a non-destructive test structure for monitoring the strength of anodic bonded glass silicon wafer compounds is introduced. The realisation of the structure, the calculation of the...
A failure criterion for interface notches in silicon/glass anodic bonds (2003)
Knaup, M., Busch, M., Bagdahn, J.
A common approach for joining silicon - structured using anisotropic etching - and glass is anodic bonding. The combination of these two techniques (etching and bonding) lead to problems concerning...