Integrated wireless neural interface based on the Utah electrode array (2009)
Kim, S., Bhandari, R., Klein, M., Negi, S., Rieth, L., Tathireddy, P., ...
This report presents results from research towards a fully integrated, wireless neural interface consisting of a 100-channel microelectrode array, a custom-designed signal processing and telemetry...
Neue Verfahren und Werkstoffe für Halbleiterkomponenten (2008)
Pötter, H., Hampicke, M., Schmitz, S., Töpper, M.
Bislang standen bei der Realisierung neuer elektronischer Systeme die Fortschritte im Bereich der Halbleitertechnologie oder Mikrosystemtechnik im Mittelpunkt des Interesses. In Zukunft werden...
Verfahren zur Herstellung einer Lotmetallisierung (2008)
Hutter, M., Engelmann, G., Töpper, M., Oppermann, H.
DE 102008014577 B3 UPAB: 20090725 NOVELTY - The method involves applying a metallization compound comprising a current transport layer on a surface (1') of a substrate (1). A photoresist is applied...
Fischer, T., Töpper, M., Jürgensen, N., Ehrmann, O., Wiemer, M., Reichl, H.
Process technology for electronic packaging and MEMS is being confronted with higher topography on the wafer due to higher complexity of the devices. Especially spin coating of photoresists has...
Zoschke, K., Wolf, M.J., Töpper, M., Ehrmann, O., Fritzsch, T., Kaletta, K., ...
Integrated passives have become increasingly popular in recent years. Especially wafer level packaging technologies offer an interesting variety of different possibilities for the implementation of...
Alternative UBM for Lead Free Solder Bumping using C4NP (2007)
Ruhmer, K., Laine, E., O'Donnell, K., Kostetsky, J., Hauck, K., Manessis, D., ...
Microelectronic packaging continues the migration from wire bond to flip chip first level interconnect (FLI) to meet aggressive requirements for improved electrical performance, reduced size and...
Zoschke, K., Feige, C., Wolf, J., Mund, D., Töpper, M., Ehrmann, O., ...
Printing solder paste in dry film - A low cost fine-pitch bumping technique (2007)
Baumgartner, T., Manessis, D., Töpper, M., Hauck, K., Ostmann, A., Reichl, H., ...
Thin film substrate technology and FC interconnection for very high frequency applications (2006)
Töpper, M., Rosin, T., Fritzsch, T., Jordan, R., Mekonnen, G., Sakkas, C., ...
High speed interconnections for the next generation internet or high frequency measurement systems need ultra fast photodetectors and appropriate high frequency transmission lines. A highly critical...
Aqueous-base-developable benzocyclobutene (BCB)-based material curable in air (2006)
Stark, E.J., Li, Y., Kisting, S., Achen, A., Baranek, K., ...
A positive-tone and aqueous-base-developable benzocyclobutene (BCB)-based dielectric material curable in air is described in this paper. The prepolymer is made from divinylsiloxane...
Experience in fabrication of multichip-modules for the ATLAS pixel detector (2006)
Fritzsch, T., Jordan, R., Töpper, M., Kuna, I., Lutz, M., Defo Kamga, F., ...
About 1100 ATLAS bare modules will be assembled at Fraunhofer IZM. The bumping and assembly technology of these multichip-modules is described in this paper. Pixel contacts and leadStin...
Packaging of radiation and particle detectors (2006)
Fritzsch, T., Jordan, R., Glaw, V., Töpper, M., Dietrich, L., Wolf, J., ...
Töpper, M., Klein, M., Buschick, K., Glaw, V., Orth, K., Ehrmann, O., ...
W-band flip-chip VCO in thin-film environment (2005)
Töpper, M., Schmückle, F.J., Lenk, F., Hutter, M., Klein, M., Oppermann, H., ...
A flip-chip packaging approach for W-band GaAs chips is presented using thin-film structures on silicon as carrier substrate. Reliability investigations indicate that, depending on bump size, the CTE...
Töpper, M., Voigt, A., Heinrich, M., Hauck, K., Mientus, R., Gruetzner, G., ...
In this paper, we present the suitability of easy to handle negative tone photoresists providing examples of lift-off applications. The lithographic process of this single layer resist system...
Interfacial adhesion analysis of BCB / TiW / Cu / PbSn technology in wafer level packaging (2003)
Töpper, M., Achen, A., Reichl, H.
The interfacial adhesion in a WLP structure was evaluated. The focus was not on absolute adhesion values but on the influence of process technology. The adhesion was measured using shear test. Four...
300mm Wafer Bumping: Printing Systems and Technologies (2002)
Töpper, M., Kloesner, J., Kasulke, P., Denise, O., Myers, J., Heyen, R.
System integration and packaging are responsible for the functionality, quality and economy of microelectronic products. Due to this fact advances packaging technologies are now no longer the niche...
The european CSP perspective (2000)
Töpper, M., Schubert, A., Reichl, H.
Packaging technology determines the size, weight, ease-of-use, durability, reliability, performance and cost of electronics. As the complexity of devices is rapidly increasing, the packaging plays a...
Surface modification due to technological treatment evaluated by SPM and XPS techniques (2000)
Krause, F., Halser, K., Töpper, M., Scherpinski, K.
Surface modification of Photo BCB due to dry and wet etching techniques is a well known procedure to increase surface quality and layer adhesion. Reactive Ion Etching is one of the suitable methods...
Reliability of flip chip and chip size packages (2000)
Reichl, H., Schubert, A., Töpper, M.
Reliability and functionality of microelectronics products utilizing advanced packaging approaches, i.e. flip chip interconnection technology, chip scale or wafer level packaging, largely depend on...
Wafer level package using double balls (2000)
Töpper, M., Glaw, V., Coskina, P., Auersperg, J., Samulewicz, K., Lange, M., ...
Töpper, M., Scherpinski, K., Landesberger, C., Ehrmann, O., Reichl, H.
A planar integration technology of ultra-thin bare dice in a Wafer-Level Thin-Film technology to yield a high-dense module is presented here. This Thin Chip Integration (TCI) technology consists of...
High density pixel detector module using flip chip and thin film technology (2000)
Wolf, J., Gerlach, P., Beyne, E., Töpper, M., Dietrich, L., Becks, K.H., ...
For the ATLAS experiment at the planned Large Hadron Collider LHC at CERN hybrid pixel detectors are being built as innermost layers of the inner tracking detector system. Modules are the basic...
Töpper, M., Auersperg, J., Glaw, V., Kaskoun, K., Prack, E., Keser, B., ...
Wafer Level Packaging has the highest potential for future single chip packages. The package is completed directly on the wafer then singulated by dicing for the assembly in a flip chip fashion. All...
First MCM-D modules for the b-physics layer of the ATLAS pixel detector (2000)
Töpper, M., Bäsken, O., Ehrmann, O., Gerlach, P., Grah, C., ...
The innermost layer (b-physics layer) of the ATLAS Pixel Detector will consist of modules based on MCM-D technology. Such a module consists of a sensor tile with an active area of 16.4 mm×60.4 mm,...
Wafer level chip size package challenges (2000)
The driving forces for new development in semiconductor IC technology are constant reductions in structure size and an increase in the overall electrical performance. The 0.25µm technology has been...
Low cost electroless copper metallization of BCB for high-density wiring systems (1999)
Töpper, M., Stolle, T., Reichl, H.
A technology development of a fully additive and selective metallization process for a structured Copper metallization on BCB was evaluated. Today semiadditive processes including vacuum steps are...
Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology (1999)
Töpper, M., Dietrich, L., Engelmann, G., Fehlberg, S., Gerlach, P., Wolf, J., ...
The MCM-D which is described here is a prototype for a pixel detector system for the planned Large Hadron Collider LHC at CERN, Geneva. The project is within the ATLAS experiment. A module consists...
Oberflächen- und Schichtcharakterisierung bei der Herstellung von Dünnfilm-NiCr-Widerständen (1999)
Töpper, M., Scherpinski, K., Krause, F., Halser, K., Ehrmann, O., Scheel, W., ...
Töpper, M., Gerlach, P., Dietrich, L., Fehlberg, S., Karduck, C., Meinherz, C., ...
The MCM-D which is described here is a prototype for a pixel detector system for the planned Large Hadron Collider LHC at CERN, Geneva. The project is within the ATLAS experiment. A module consists...
Entwicklung eines CSP auf Waferebene (1999)
Simon, J., Auersperg, J., Busse, E., Heinricht, K., Kallmayer, C., ...
Integration of NiCr resistors in a multilayer Cu/BCB wiring system (1999)
Scherpinski, K., Töpper, M., Hahn, R., Ehrmann, O., Reichl, H.
The integration of passive components into the wiring substrate is essential for the further miniaturization and cost reduction of electronic systems. CSP and high density multilayer boards are...
Schablonendruck für Flip Chip and Waferlevel CSP (1999)
Töpper, M., Coskina, P., Kloeser, J., Jung, E., Achenbrenner, R., Reichl, H.
Die Forderung in der Mikroelektronik und der Elektroindustrie nach erhöhter Zuverlässigkeit, Funktionalität, Leistungsfähigkeit und Miniaturisierung bei gleichzeitiger Kostenreduzierung von...
Wafer Bumping for Wafer-Level CSPs and Flip Chips using Stencil Printing Technology (1999)
Töpper, M., Coskina, P., Krause, F., Halser, K., Ehrmann, O., Scheel, W., ...
In this paper the experimental work of stencil printing for creating solder bumps on wafer-level CSP (CSP-WL) is described in detail. In the first part the basic process steps for wafer-level CSP's...
Novel packaging concept for high power multichip modules (1998)
Hahn, R., Töpper, M., Reichl, H.
Multichip modules (MCMs) offer significant reduction in both interconnection signal delay and microelectronics packaging volume. However, this integration results in higher heat flux densities in the...
Mask aligners in advanced packaging (1998)
Töpper, M., Tönnies, D., Wolf, J., Engelmann, G., Reichl, H.
New packaging technologies, developed to support the increasing functionality and performance of today's and future IC generations, increasingly use photolithography for the fabrication of...
Experience with a fully automatic flip-chip assembly line integrating SMT (1998)
Klöser, J., Kutzner, K., Jung, E., Heinricht, K., Lauter, L., Töpper, M.
The Fraunhofer Institute (FhG/IZM-Berlin) together with several industrial partners has set up a demonstration center for the assembly of flip chips (FC) and chip size packages (CSP). It consists of...
Combination of MCM-C technology with MCM-D technology using photosensitive polymers (1998)
Töpper, M., Scherpinski, K., Hahn, R., Ehrmann, O., Reichl, H., Schmaus, C., ...
A combination of ceramic substrate technology with thin film processes will be presented. Thick film hybrids are used for the bottom layers and a thin film metallization layer is deposited on top for...
Chip size package - the option of choice for miniaturized medical devices (1998)
Töpper, M., Schaldach, M., Fehlberg, S., Karduck, C., Meinherz, C., Heinricht, K., ...
Especially for medical implantables applications size reduction of electronic packaging is coupled with a high functionality and high reliability. In this paper an implantable microelectronic system...
A multichip module integration technology for high-speed analog and digital applications (1998)
Töpper, M., Mangold, T., Wolf, J., Reichl, H., Russer, P.
We present a planar multichip module integration technology intended for high frequency applications. Bare dice are placed in substrate openings and connected through a thin film multilayer realized...
System Integration for High Frequency Applications (1998)
Töpper, M., Wolf, J., Schmückle, F.J., Heinrich, W., Buschick, K., Owzar, A., ...
Thin film multilayer substrate technology with dielectric polymer layers and sputtered/electroplated wiring provide the highest line density per layer and therefore they are of special interest for...
Multichip-modules for high frequency applications (1997)
Wolf, J., Schmückle, S.J., Owzar, A., Töpper, M., Buschick, K., Reichl, H.
Thinfilm multilayer substrate technology with dielectric polymer layers and sputtered/electroplated wiring system provide the highest line density per layer and therefore they are of special interest...
Laser machining of ceramics for MCM-D applications (1997)
Glaw, V., Hahn, R., Wolf, J., Töpper, M., Buschick, K., Hein, U., ...
Hahn, R., Kamp, A., Ginolas, A., Schmidt, M., Wolf, J., Glaw, V., ...
High performance cooling technology for Multi Chip Modules (MCM-D) with planar embedded dice (1997)
Hahn, R., Töpper, M., Schmidt, M., Kamp, A., Ginolas, A., Wolf, J., ...
Multichip modules (MCMs) offer significant reduction in both interconnection signal delay and microelectronics packaging volume. However, this integration results in higher heat flux densities in the...
Embedding technology - a chip-first approach using BCB (1997)
Töpper, M., Buschick, K., Wolf, J., Glaw, V., Hahn, R., Dabek, A., ...
With the current trend to ever faster clock rates the propagation delays between the chips constitute a significant portion of the clock cycle. Mounting both active and passive devices as closely...
Töpper, M., Glaw, V., Hahn, R., Schaldach, M., Schmaus, C., Bechtold, F., ...
Um unnötige kostenintensive Verfahrensschritte im Dünnfilmprozess zu vermeiden, ist der Einsatz von photosensitiven polymeren Dielektrika geboten. Hochtemperaturstabile photosensitive...
BCB - a polymer for thinfilm applications (1997)
Töpper, M., Ehrmann, O., Reichl, H., Glaw, V., Wolf, J., Fischbeck, G., ...
Thinfilm organic polymers have played a mayor role in the technologies of electronic packaging. Polymer films having low dielectric constants (less than 4) are being used to fabricate high density...
Töpper, M., Hahn, R., Kamp, A., Ginolas, A., Schmidt, M., Wolf, J., ...
This paper describes a novel packaging technology for high power multi chip modules (MCMs). The work covers three areas: The fabrication of a multichip module which provides access to the die...
Der Weg zum Chip-Size-Package (1997)
The trend in mounting and connecting techniques towards reducing the weight and size of the IC housing has consistently progressed from the Dual In-line Package (DIP), the Plastic Quad Flat Package...
Der Weg zum Chip Size Package (CSP) (1997)
Der Trend in der Aufbau- und Verbindungstechnik, sowohl Gewicht als auch Größe der IC-Gehäuse zu reduzieren, führte zwangsläufig vom Dual-In-Line-Package (DIP) und Plastic-Quad-Flat-Package...
Alternative solder deposition using transfer technique (1996)
Töpper, M., Wolf, J., Reichl, H.
Flip-chip mounting using soft solder offers several advantages in comparison with other chip-mounting technologies both in processing and performance and makes this technology very attractive...
Fabrication of high power MCMs by planar embedding technique and active cooling (1996)
Töpper, M., Hahn, R., Wolf, J., Glaw, V., Buschick, K., Hoehne, J., ...
This paper descibes the planar embedding technique for the fabrication of high power mulitchip modules (MCM-D). A back side planarizing process was developed which allowed a low thermal resistivity...
Design concept for singlemode polymer waveguides (1996)
Töpper, M., Fischbeck, G., Moosburger, R., Petermann, K.
A novel waveguide concept is presented, which is applicable to a multitude of optical polymers. It allows for singlemode single polymer waveguides with large cross-sections, despite considerable...
Redistribution technology for chip scale package using photosensitive BCB (1996)
Töpper, M., Simon, J., Reichl, H.
The advantages of flip chip technology with regard to electrical performance and reduced mounting area are well-known. Unfortunately most of the available dice are not designed for flip chip...
The photolysis of pure and mixed palladium acetate thin films (1996)
Töpper, M., Stolle, T., Wäsche, M.
The photochemical features of pure Palladium acetate thin films, thin films of BCB prepolymers, mixtures of both and mixtures of Palladium acetate with 2.6-Bis have been investigated by UV-Vis- and...
Integrated thermo-optical switch based on polymer rib waveguides (1996)
Töpper, M., Moosburger, R., Fischbeck, G., Kostrzewa, C., Petermann, K.
MCM-D with embedded active and passive components (1996)
Töpper, M., Wolf, J., Glaw, V., Buschick, K., Dabek, A., Dietrich, L., ...
A planar integration technology of bare dice together with passive SMDs embedded in ceramic substrates to yield a high-dense MCM-D is presented. The components are inserted into premanufactured...
Mehrlagenverdrahtung für MCM-D und Chip Size Package (1996)
Töpper, M., Buschick, K., Wolf, J., Dietrich, L., Ehrmann, O.
Thin film technologies for single-mode polymer waveguides (1996)
Töpper, M., Fischbeck, G., Moosburger, R., Petermann, K., Krabe, D., Reichl, H.
The rapidly rising data transmission rates both in telecommunication and computer networks generate a growing demand for low cost single-mode integrated optical components. In view of their potential...
Metallisierung von Polymeren für Dünnfilmverdrahtungen (1996)
Töpper, M., Schmidt, R., Hannemann, M., Schammler, G., Hempel, G.
BCB mit seinen hervorragenden thermisch-mechanischen und dielektrischen Eigenschaften ist als Dünnfilmverdrahtungsträger für die MCM-D-Technologie besonders geeignet. Da es von diesem Material...
On-Chip Umverdrahtung - eine Möglichkeit zur Anpassung von Chip- und Leiterplattenraster (1995)
Chmiel, G., Töpper, M., Simon, J., Reichl, H.
Die Einführung einer On-Chip-Umverdrahtung erlaubt Realisierung einer Matrix von Anschlußpads auf Standardchips. Die Nutzung der gesamten Chipfläche ermöglicht eine Anpassung des Anschlußrasters...
A comparison of flip chip technology with chip size packages (1995)
Simon, J., Töpper, M., Reichl, H., Chmiel, G.
The advantages of flip chip technology concerning electrical performance and smallest mounting area are well-known. Unfortunately most of the available dice are not designed for flip chip application...
Thinfilm multichip modules - Process development using photosensitive benzocyclobutane (1994)
Chmiel, G., Töpper, M., Jöhren, C., Achen, A.
Used as interlayer dielectric photosensitive BCB combines several beneficial properties of Cyclotene 3022 and other photosensitive polymers such as polyimides. To study the processing parameters...