Zhang, Rongwei, Li, Yi, Yim, Myung Jin, Moon, Kyoung Sik, Lu, Daoqiang Daniel, Wong, C. P.
© 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for...
Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill (2009)
Lee, Sangil, Yim, Myung Jin, Master, Raj N., Wong, C. P., Baldwin, Daniel F.
© 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for...
Li, Yi, Yim, Myung Jin, Moon, Kyoung Sik, Wong, C. P.
© 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for...
Void Formation Study of Flip Chip in Package Using No-Flow Underfill (2008)
Lee, Sangil, Yim, Myung Jin, Master, Raj N., Wong, C. P., Baldwin, Daniel F.
©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale...
Wafer Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs) (2007)
Son, Ho Young, Chung, Chang Kyu, Yim, Myung Jin, Hwang, Jin Sang, Paik, Kyung Wook, Jung, Gi Jo, ...
Recently, wafer-level packaging (WLP) has become one of the promising packaging technologies due to its advantages, such as fewer processing steps, lower cost, and enhanced device performance...
Dong, Hai, Li, Yi, Yim, Myung Jin, Moon, Kyoung-Sik, Wong, C. P.
©2007 American Institute of Physics. The electronic version of this article is the complete one and can be found online at: http://link.aip.org/link/?APPLAB/90/092102/1
Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications (2007)
Yim, Myung Jin, Hwang, Jin Sang, Paik, Kyung Wook
This paper describes the development of anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) application. In order to have reliable COG interconnects using ACF at fine pitch,...
Hwang, Jin Sang, Yim, Myung Jin, Paik, Kyung Wook
The effects of the functionality of an epoxy monomer on the composite properties and reliability of anisotropic conductive films (ACFs) in a flip-chip package were investigated. Three epoxy monomers...
Yim, Myung Jin, Paik, Kyung Wook
Anisotropic conductive films (ACFs) consist of conducting particles and adhesive polymer resins in a film type and have been widely used for the flat panel display module to be high-resolution, light...
Yim, Myung Jin, Kim, Hyoung Joon, Chung, Chang Kyu, Paik, Kyung Wook
In this paper, we investigated the degradation mechanism and the reliability behaviors of flip chip joint using Anisotropic Conductive Adhesives (ACAs) and Au bumped chip under high current density....
Son, Ho Young, Chung, Chang Kyu, Yim, Myung Jin, Paik, Kyung Wook
Recently, wafer level package (WLP) has become one of the promising packaging technologies due to its advantages such as fewer processing steps, lower cost, and enhanced device performance compared...
Lee, Ki Won, Kim, Hyoung Joon, Yim, Myung Jin, Paik, Kyung Wook
In this study, the curing and bonding behaviors of ACFs by ultrasonic vibration for flip chip interconnection were investigated using a 40 kHz ultrasonic bonder with longitudinal vibration. In-situ...
Kim, Hyoung Joon, Chung, Chang Kyu, Yim, Myung Jin, Paik, Kyung Wook
Because of downsizing of electronic products and cost effectiveness, rigid substrate-flexible substrate (RS-FS) bonding technology using ACFs becomes more important as an alternative to socket type...
Yim, Myung Jin, Kwon, Woonseong, Paik, Kyoung Wook
The dielectric property of anisotropic conductive film (ACF) as an interconnect materials in the flip–chip joints is becoming important concern for device packaging solution at high-frequency due...
Yim, Myung Jin, Jeong, Inho, Choi, Hyung Kyu, Hwang, Jin Sang, Ahn, Jin Yong, Kwon, Woonseong, ...
Anisotropic conductive adhesives (ACAs) are as promising interconnect materials for flip chip assembly in low cost, high-density, high-speed interconnection packages. We evaluated and compared...
Hwang, Jin Sang, Yim, Myung Jin, Paik, Kyung Wook
The flip-chip technology using anisotropic conductive films (ACFs) is gaining growing interest due to its technical advantages such as environmentally friendly, simpler, and lower cost processes....
Yim, Myung Jin, Kim, Hyoung Joon, Paik, Kyung Wook
This paper presents the development of new anisotropic conductive adhesives (ACAs) with enhanced thermal conductivity for improved reliability of adhesive flip chip assembly under high current...
Jang, Kyung Woon, Kwon, Woon Seong, Yim, Myung Jin, Paik, Kyung Wook
Abstract—In this paper, thermomechanical and rheological properties of nonconductive pastes (NCPs) depending on silica filler contents and diluent contents were investigated. And then, thermal...
Yim, Myung Jin, Hwang, Jin Sang, Kim, Jin Gu, Kwon, Woon Seong, Jang, Kyung Woon, Paik, Kyung Wook
hi this paper, we present the development work of anisotropic conductive adhesives with particular emphasis on the enhanced thermal conductivity of ACAs for flip chip application. To ensure good...
High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications, (2002)
Yim, Myung Jin, Hwang, Jin Sang, Kwon, Woon Seong, Jang, Kyung Woon, Paik, Kyung Wook
Chip Scale Packages have been adapted for mobile phones, DVC, PC cards, PDA’s and various others due to the robustness, cost effectiveness, and high reliability of CSP packages. For first level...