3D process integration - requirements and challenges (2009)
Wolf, M.J., Klumpp, A., Zoschke, K., Wieland, R., Nebrich, L., Klein, M., ...
Heterogeneous system integration is one of the key topics for future system integration. Scaling of System on Chip (SoC) alone does not address today's requirements of smart electronic systems in...
Profile of the wafer level ECD gold bumps under variable parameters (2008)
Jing, X.M., Engelmann, G., Chen, D., Wolf, J., Ehrmann, O., Reichl, H.
The uniformity and deformation of electrochemical deposition (ECD) bumps get more and more important with the pitch shrinking and density increasing according to the requirement of modern electronic...
First MCM-D Modules for the B-Physics Layer of the ATLAS Pixel Detector (2007)
Bsken Becks Ehrmann, O. Bäsken, O. Ehrmann, P. Gerlach, Ch. Grah, ...
The innermost layer (b-physics layer) of the ATLAS Pixel Detector will consist of modules based on MCM-D technology. Such a module consists of a sensor tile with an active area of 16.4 mm x 60.4 mm,...
First MCM-D Modules for the B-Physics Layer of the ATLAS Pixel Detector (2007)
Bsken Becks Ehrmann, O. Bäsken, O. Ehrmann, P. Gerlach, Ch. Grah, ...
The innermost layer (b-physics layer) of the ATLAS Pixel Detector will consist of modules based on MCM-D technology. Such a module consists of a sensor tile with an active area of 16.4 mm x 60.4 mm,...
Fischer, T., Töpper, M., Jürgensen, N., Ehrmann, O., Wiemer, M., Reichl, H.
Process technology for electronic packaging and MEMS is being confronted with higher topography on the wafer due to higher complexity of the devices. Especially spin coating of photoresists has...
Zoschke, K., Wolf, M.J., Töpper, M., Ehrmann, O., Fritzsch, T., Kaletta, K., ...
Integrated passives have become increasingly popular in recent years. Especially wafer level packaging technologies offer an interesting variety of different possibilities for the implementation of...
Eckmeier, E., Gerlach, R., Skjemstad, J. O., Ehrmann, O., Schmidt, M. W. I.
Anthropogenic fires affected the temperate deciduous forests of Central Europe over millennia. Biomass burning releases carbon to the atmosphere and produces charcoal, which potentially contributes...
Eckmeier, E., Gerlach, R., Skjemstad, J. O., Ehrmann, O., Schmidt, M. W. I.
Anthropogenic fires affected the temperate deciduous forests of Central Europe over millennia. Biomass burning releases carbon to the atmosphere and produces charcoal, which potentially contributes...
Eckmeier, E., Gerlach, R., Skjemstad, J. O., Ehrmann, O., Schmidt, M. W. I.
Anthropogenic fires affected the temperate deciduous forests of Central Europe over millennia. Biomass burning releases carbon to the atmosphere and produces charcoal, which potentially contributes...
Eckmeier, E., Gerlach, R., Skjemstad, J. O., Ehrmann, O., Schmidt, M. W. I.
Anthropogenic fires affected the temperate deciduous forests of Central Europe over millennia. Biomass burning releases carbon to the atmosphere and produces charcoal, which potentially contributes...
Zoschke, K., Feige, C., Wolf, J., Mund, D., Töpper, M., Ehrmann, O., ...
E. Eckmeier, R. Gerlach, J. O. Skjemstad, O. Ehrmann
Anthropogenic fires affected the temperate deciduous forests of Central Europe over millennia. Biomass burning releases carbon to the atmosphere and produces charcoal, which potentially contributes...
Multi-Chip-Modul und Verfahren zum Herstellen eines Multi-Chip-Moduls (2006)
Landesberger, C., Reichl, H., Ansorge, F., Ramm, P., Ehrmann, O.
Experience in fabrication of multichip-modules for the ATLAS pixel detector (2006)
Fritzsch, T., Jordan, R., Töpper, M., Kuna, I., Lutz, M., Defo Kamga, F., ...
About 1100 ATLAS bare modules will be assembled at Fraunhofer IZM. The bumping and assembly technology of these multichip-modules is described in this paper. Pixel contacts and leadStin...
Packaging of radiation and particle detectors (2006)
Fritzsch, T., Jordan, R., Glaw, V., Töpper, M., Dietrich, L., Wolf, J., ...
Stackable thin film multi layer substrates with integrated passive components (2006)
Zoschke, K., Buschick, K., Scherpinski, K., Fischer, T., Wolf, J., Ehrmann, O., ...
Töpper, M., Klein, M., Buschick, K., Glaw, V., Orth, K., Ehrmann, O., ...
Töpper, M., Voigt, A., Heinrich, M., Hauck, K., Mientus, R., Gruetzner, G., ...
In this paper, we present the suitability of easy to handle negative tone photoresists providing examples of lift-off applications. The lithographic process of this single layer resist system...
Flexible circuit carrier with integrated passives for high density integration (2004)
Fischer, T., Zoschke, K., Scherpinski, K., Buschick, K., Ehrmann, O., Wolf, M.J., ...
Autarke verteilte Mikrosysteme stellen durch ihre Kompaktheit eine besondere Herausforderung an die Aufbau- und Verbindungstechnik. Durch die Anforderung, eine Systemintegration in einem definierten...
Characterization of electroplated leadfree bumps (2004)
Wolf, M.J., Ehrmann, O., Reichl, H.
Pb-free solder is one of the biggest issues in today's electronic packaging industry. This paper introduces a developed Sn/3.5Ag alloy plating process for wafer level bumping. The effects of Under...
Jang, S.Y., Wolf, J., Ehrmann, O., Gloor, H., Reichl, H., Paik, K.W.
Abstract—Electroplating solder bumping process offers fine pitch, highly reliable, and cost effective advantages for flip-chip technology. In this technology, under bump metallization (UBM) is...
Jang, S.Y., Wolf, J., Ehrmann, O., Gloor, H., Schreiber, T., Reichl, H., ...
The electroplating solder bumping process offers fine pitch, high reliability, and cost effective advantages for flip-chip technology. In this technology, under bump metallization (UBM) is required...
An experimental approach to Neolithic shifting cultivation (2002)
Rösch, M., Ehrmann, O., Herrmann, L., Schulz, E., Bogenrieder, A., Goldammer, J. G., ...
Hutter, M., Oppermann, H., Engelmann, G., Wolf, J., Ehrmann, O., Aschenbrenner, R., ...
Eutectic Au/Sn 80/20 solder is used more and more for flip chip assembly especially of optoelectronic devices because no flux is necessary during soldering. Galvanic deposited AuSn bumps are created...
Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study (2002)
Jang, S.Y., Wolf, J., Ehrmann, O., Reichl, H., Paik, K.W.
This paper describes newly defined eutectic SnAg solder bumping process using an alloy electroplating method and the interface reactions between four different types of UBM (under bump metallurgy)...
Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM) (2002)
Jang, S.Y., Wolf, J., Ehrmann, O., Gloor, H., Reichl, H., Paik, K.W.
Pb-free solder is one of the biggest issues in today's electronic packaging industry. This paper introduces a newly developed Sn/3.5Ag alloy plating process For wafer level bumping. The effects of...
Krabe, D., Lang, G., Springer, A., Hagenbuechle, M., Buschick, K., Ehrmann, O., ...
WO 200002247 A UPAB: 20000330 NOVELTY - The method involves mounting the components (3) outside the carrier body (4) in a plane approximately parallel to the carrier body surface. Components are...
Wafer level package using double balls (2000)
Töpper, M., Glaw, V., Coskina, P., Auersperg, J., Samulewicz, K., Lange, M., ...
Töpper, M., Scherpinski, K., Landesberger, C., Ehrmann, O., Reichl, H.
A planar integration technology of ultra-thin bare dice in a Wafer-Level Thin-Film technology to yield a high-dense module is presented here. This Thin Chip Integration (TCI) technology consists of...
High density pixel detector module using flip chip and thin film technology (2000)
Wolf, J., Gerlach, P., Beyne, E., Töpper, M., Dietrich, L., Becks, K.H., ...
For the ATLAS experiment at the planned Large Hadron Collider LHC at CERN hybrid pixel detectors are being built as innermost layers of the inner tracking detector system. Modules are the basic...
Töpper, M., Auersperg, J., Glaw, V., Kaskoun, K., Prack, E., Keser, B., ...
Wafer Level Packaging has the highest potential for future single chip packages. The package is completed directly on the wafer then singulated by dicing for the assembly in a flip chip fashion. All...
Wafer-level chip size package (WL-CSP) (2000)
Topper, M., Fehlberg, S., Scherpinski, K., Karduck, C., Glaw, V., Heinricht, K., ...
Size reduction is one of the main driving forces for packaging in nearly all electronic applications. The interaction of size reduction with highest functionality and high reliability is also...
Characteristics of fritting contacts utilized for micromachined wafer probe cards (2000)
Itoh, T., Suga, T., Engelmann, G., Wolf, J., Ehrmann, O., Reichl, H.
First MCM-D modules for the b-physics layer of the ATLAS pixel detector (2000)
Töpper, M., Bäsken, O., Ehrmann, O., Gerlach, P., Grah, C., ...
The innermost layer (b-physics layer) of the ATLAS Pixel Detector will consist of modules based on MCM-D technology. Such a module consists of a sensor tile with an active area of 16.4 mm×60.4 mm,...
Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology (1999)
Töpper, M., Dietrich, L., Engelmann, G., Fehlberg, S., Gerlach, P., Wolf, J., ...
The MCM-D which is described here is a prototype for a pixel detector system for the planned Large Hadron Collider LHC at CERN, Geneva. The project is within the ATLAS experiment. A module consists...
Oberflächen- und Schichtcharakterisierung bei der Herstellung von Dünnfilm-NiCr-Widerständen (1999)
Töpper, M., Scherpinski, K., Krause, F., Halser, K., Ehrmann, O., Scheel, W., ...
Töpper, M., Gerlach, P., Dietrich, L., Fehlberg, S., Karduck, C., Meinherz, C., ...
The MCM-D which is described here is a prototype for a pixel detector system for the planned Large Hadron Collider LHC at CERN, Geneva. The project is within the ATLAS experiment. A module consists...
Integration of NiCr resistors in a multilayer Cu/BCB wiring system (1999)
Scherpinski, K., Töpper, M., Hahn, R., Ehrmann, O., Reichl, H.
The integration of passive components into the wiring substrate is essential for the further miniaturization and cost reduction of electronic systems. CSP and high density multilayer boards are...
A MCM-D-type module for the atlas pixel detector (1999)
Becks, K.H., Beyne, E., Ehrmann, O., Gerlach, P., Gregor, I.M., Pieters, P., ...
A MCM-D-type module for the ATLAS pixel detector (1999)
Beyne, E., Ehrmann, O., Gerlach, P., Gregor, I.M., Pieters, P., ...
For the ATLAS experiment at the planned Large Hadron Collider LHC at CERN hybrid pixel detectors are being built as innermost layers of the inner tracking detector system. Modules are the basic...
Wafer Bumping for Wafer-Level CSPs and Flip Chips using Stencil Printing Technology (1999)
Töpper, M., Coskina, P., Krause, F., Halser, K., Ehrmann, O., Scheel, W., ...
In this paper the experimental work of stencil printing for creating solder bumps on wafer-level CSP (CSP-WL) is described in detail. In the first part the basic process steps for wafer-level CSP's...
Baur, M., Schumm, T., Wertheimer, R., Schanz, M., Eckart, T., Nitta, C., ...
Im vorliegenden Beitrag wird ein hochsprachenprogrammierbares System zur schritthaltenden Vollbild-Interpretation natürlich beleuchteter Szenenfolgen im Videotakt vorgestellt. Im einzelnen werden...
Combination of MCM-C technology with MCM-D technology using photosensitive polymers (1998)
Töpper, M., Scherpinski, K., Hahn, R., Ehrmann, O., Reichl, H., Schmaus, C., ...
A combination of ceramic substrate technology with thin film processes will be presented. Thick film hybrids are used for the bottom layers and a thin film metallization layer is deposited on top for...
Chip size package - the option of choice for miniaturized medical devices (1998)
Töpper, M., Schaldach, M., Fehlberg, S., Karduck, C., Meinherz, C., Heinricht, K., ...
Especially for medical implantables applications size reduction of electronic packaging is coupled with a high functionality and high reliability. In this paper an implantable microelectronic system...
A MCM-D-type Module for the ATLAS Pixel Detector (1998)
Becks Beyne Ehrmann, E. Beyne, O. Ehrmann, P. Gerlach, I. M. Gregor, ...
For the ATLAS experiment at the planned Large Hadron Collider LHC at CERN hybrid pixel detectors are being built as innermost layers of the inner tracking detector system. Modules are the basic...
System Integration for High Frequency Applications (1998)
Töpper, M., Wolf, J., Schmückle, F.J., Heinrich, W., Buschick, K., Owzar, A., ...
Thin film multilayer substrate technology with dielectric polymer layers and sputtered/electroplated wiring provide the highest line density per layer and therefore they are of special interest for...
Laser machining of ceramics for MCM-D applications (1997)
Glaw, V., Hahn, R., Wolf, J., Töpper, M., Buschick, K., Hein, U., ...
Hahn, R., Kamp, A., Ginolas, A., Schmidt, M., Wolf, J., Glaw, V., ...
High performance cooling technology for Multi Chip Modules (MCM-D) with planar embedded dice (1997)
Hahn, R., Töpper, M., Schmidt, M., Kamp, A., Ginolas, A., Wolf, J., ...
Multichip modules (MCMs) offer significant reduction in both interconnection signal delay and microelectronics packaging volume. However, this integration results in higher heat flux densities in the...
Embedding technology - a chip-first approach using BCB (1997)
Töpper, M., Buschick, K., Wolf, J., Glaw, V., Hahn, R., Dabek, A., ...
With the current trend to ever faster clock rates the propagation delays between the chips constitute a significant portion of the clock cycle. Mounting both active and passive devices as closely...
BCB - a polymer for thinfilm applications (1997)
Töpper, M., Ehrmann, O., Reichl, H., Glaw, V., Wolf, J., Fischbeck, G., ...
Thinfilm organic polymers have played a mayor role in the technologies of electronic packaging. Polymer films having low dielectric constants (less than 4) are being used to fabricate high density...
Töpper, M., Hahn, R., Kamp, A., Ginolas, A., Schmidt, M., Wolf, J., ...
This paper describes a novel packaging technology for high power multi chip modules (MCMs). The work covers three areas: The fabrication of a multichip module which provides access to the die...
Fabrication of high power MCMs by planar embedding technique and active cooling (1996)
Töpper, M., Hahn, R., Wolf, J., Glaw, V., Buschick, K., Hoehne, J., ...
This paper descibes the planar embedding technique for the fabrication of high power mulitchip modules (MCM-D). A back side planarizing process was developed which allowed a low thermal resistivity...
MCM-D with embedded active and passive components (1996)
Töpper, M., Wolf, J., Glaw, V., Buschick, K., Dabek, A., Dietrich, L., ...
A planar integration technology of bare dice together with passive SMDs embedded in ceramic substrates to yield a high-dense MCM-D is presented. The components are inserted into premanufactured...