R. Streiter

Electronic transport properties in copper nanowire (2008)

Mohammadzadeh, S., Pouladsaz, D., Streiter, R., Gessner, T.

In present work, we study the electronic transport properties of copper nanowire using the non-equilibrium Green's function technique on the density functional tight binding method for modelling the...

Empirical modeling of oxide CMP at chip scale (2005)

Wolf, H., Streiter, R., Rzehak, R., Meyer, F., Springer, G.

Application of molecular dynamics to the simulation of IPVD (2004)

Belsky, P., Streiter, R., Wolf, H., Gessner, T.

Investigation of long throw PVD of titanium films from polycrystalline targets with texture (2002)

Wolf, H., Streiter, R., Tirschler, W., Giegengack, H., Urbansky, N., Gessner, T.

The influence of target properties on the deposition of titanium films by long throw sputtering has been studied using Monte Carlo simulation. The precise knowledge and consideration of existing...

Application of combined thermal and electrical simulation for optimization of deep submicron interconnection systems (2002)

Streiter, R., Wolf, H., Zhu, Z., Xiao, X., Gessner, T.

Application of combined thermal and electrical simulation for optimization of deep submicron interconnection systems (2002)

Streiter, R., Wolf, H., Zhu, Z., Xiao, X., Gessner, T.

Thermal and electrical simulation of deep submicron interconnection systems (2002)

Streiter, R., Wolf, H., Zhu, Z., Xiao, X., Gessner, T.

Closed-form formulae for frequency-dependent 3-D interconnect inductance (2001)

Zhu, Z., Xiao, X., Streiter, R., Ruan, G., Otto, T., Wolf, H., ...

Simulation of the dielectric constant of aerogels and estimation of their water content (2001)

Xiao, X., Streiter, R., Wolf, H., Ruan, G., Murray, C., Gessner, T.

Modelling and simulation for dielectric constant of aerogel (2000)

Xiao, X., Streiter, R., Ruan, G., Song, R.R., Otto, T., Gessner, T.

Numerical simulation of time delay and cross-talk noise for the interconnect in VLSI circuits (2000)

Ruan, G., Xiao, X., Song, R.R., Streiter, R., Otto, T., Gessner, T.

Process and equipment simulation of copper CVD using Cu(hfac)vtms (1999)

Wolf, H., Gieser, H., Riedel, S., Streiter, R., Gessner, T.

Process and equipment simulation of dry silicon etching in the absence of ion bombardment (1999)

Otto, T., Wolf, H., Streiter, R., Dehoff, A., Wandel, K., Gessner, T.

Simulation of dry silicon etching in the absence of ion bombardment: An example for cooperation between process development and equipment design (1999)

Otto, T., Hofmann, M., Wolf, H., Streiter, R., Schubert, A., Gessner, T.