Yunus, E.M., Spearing, S.M., McBride, J.W
Carbon nanotube (CNT)-coated surfaces are investigated to determine the electrical contact performance under low force conditions. The surfaces under investigation are vertically aligned multiwalled...
McBride, J.W., Yunus, E.M., Spearing, S.M.
An experimental investigation of a gold coated vertically aligned carbon nanotube surfaces is undertaken to determine the limits of the electrical contact performance over a large number of switching...
Multiscale mechanics modeling of direct silicon wafer bonding (2009)
Kubair, D.V., Cole, D.J., Ciacchi, L.C., Spearing, S.M.
The direct bonding of macroscopically patterned silicon wafers is studied with a cohesive zone model (CZM), the form and key parameters of which are obtained from molecular dynamics simulations. The...
Improving the contact resistance at low force using gold coated carbon nanotube surfaces. (2009)
Yunus, E.M., McBride, J.W., Spearing, S.M.
Investigations to determine the electrical contact performance under repeated cycles at low force conditions for carbon-nanotube (CNT) coated surfaces were performed. The surfaces under investigation...
Yunus, E.M., McBride, J.W., Spearing, S.M.
Gold coated vertically aligned multi-walled carbon-nanotubes (Au/MWCNT) surfaces are investigated to determine the electrical contact performance under low force conditions with repeated load...
Ultra high resolution computed tomography of damage in notched carbon fiber-epoxy composites (2008)
Wright, Peter, Fu, X., Sinclair, I., Spearing, S.M.
This article presents the first use of synchrotron radiation computed tomography (SRCT) to achieve sub-micron resolution of damage in aerospace grade carbon fiber–epoxy composites. The structure...
Optimal materials selection for bimaterial piezoelectric microactuators (2008)
Srinivasan, P., Spearing, S. M.
Piezoelectric actuation is one of the commonly employed actuation schemes in microsystems. This paper focuses on identifying and ranking promising active material/substrate combinations for...
Improving the contact resistance at low force using gold coated carbon nanotube surfaces (2008)
Yunus, E.M., McBride, J.W., Spearing, S.M.
Investigations to determine the electrical contact performance under repeated load cycles at low force conditions for carbonnanotube (CNT) coated surfaces were performed. The surfaces under...
Yunus, E.M., McBride, J.W., Spearing, S.M.
Carbon-Nanotube (CNT) coated surfaces are investigated to determine the electrical contact performance under low force conditions. The surfaces under investigation are multi-walled CNTs formed on a...
A novel method for nanoprecision alignment in wafer bonding applications (2007)
Jiang, Liudi, Pandraud, G., French, P.J., Spearing, S.M., Kraft, M.
Wafer bonding has been identified as a promising technique to enable fabrication of many advanced semiconductor devices such as three-dimensional integrated circuits (3D IC) and micro/nano systems....
Diamond and diamond-like carbon MEMS (2007)
Luo, J.K., Fu, Y.Q., Williams, J.A., Spearing, S.M., Milne, W.I.
Diamond and diamond-like carbon (DLC) thin films possess a number of unique and attractive material properties that are unattainable from Si and other materials. These include high values of Young's...
Wafer bonding with nanoprecision alignment for micro/nano systems (2007)
Jiang, Liudi, Pandraud, G., French, P.J., Spearing, S.M., Kraft, M.
Exploiting mechanical principles of kinematic and elastic averaging, a novel passive approach has been developed to achieve nanoprecision bonding alignment. Alignment features comprising cantilever...
Materials selection and design of microelectrothermal bimaterial actuators (2007)
A common form of MEMS actuator is a thermally actuated bimaterial, which is easy to fabricate by surface micromachining and permits out of plane actuation, which is otherwise difficult to achieve....
Shim, D-J, Spearing, S.M., Yang, Q.
Crack initiation and growth behavior in solder joints under cyclic shear deformation using piezomechanical actuation have been investigated. Experiments were conducted on specimens that consist of...
Cohesive zone model for direct silicon wafer bonding (2007)
Direct silicon wafer bonding and decohesion are simulated using a spectral scheme in conjunction with a rate-dependent cohesive model. The cohesive model is derived assuming the presence of a thin...
Cole, D.J., Payne, M.C., Csanyi, G., Spearing, S.M., Ciacchi, L.C.
We have developed a classical two- and three-body interaction potential to simulate the hydroxylated, natively oxidized Si surface in contact with water solutions, based on the combination and...
A novel method for nanoprecision alignment in wafer bonding applications (2007)
Jiang, L., Pandraud, G., French, P.J., Spearing, S.M., Kraft, M.
A novel method for nanoprecision alignment in wafer bonding applications (2007)
Jiang, L., Pandraud, G., French, P.J., Spearing, S.M., Kraft, M.
Cole, D.J., Payne, M.C., Csanyi, G., Spearing, S.M., Ciacchi, L.C.
We have developed a classical two- and three-body interaction potential to simulate the hydroxylated, natively oxidized Si surface in contact with water solutions, based on the combination and...
Mechanics of direct wafer bonding (2006)
Direct wafer bonding is a manufacturing process that is used in the fabrication of electronic, optical and mechanical microsystems. The initial step in the process requires that the wafers are...
Multistack silicon-direct wafer bonding for 3D MEMS manufacturing (2003)
Miki, N., Zhang, X., Khanna, R., Ayon, A.A., Ward, D., Spearing, S.M.
Characterization of silicon-wafer bonding for power MEMS applications (2003)
Ayon, A.A., Zhang, X., Turner, K.T., Choi, D.W., Miller, B., Nagle, S.F., ...
A Systematic Approach to Process Selection in MEMS (2003)
D. J. Quinn, S. M. Spearing, M. F. Ashby, N. A. Fleck
A systematic approach is developed to select manufacturing Process Chains for the generic elements of a MEMS device. A database of MEMS Process Chains and their attendant process attributes is...