Mechanical Design and Material Budget of the CMS Barrel Pixel Detector (2009)
Amsler, C, Bösiger, K, Chiochia, V, Maier, R, Meyer, H, Robmann, P, ...
The Compact Muon Solenoid experiment at the Large Hadron Collider at CERN includes a silicon pixel detector as its innermost component. Its main task is the precise reconstruction of charged...
Mechanical Design and Material Budget of the CMS Barrel Pixel Detector (2009)
Amsler, C., Bösiger, K., Chiochia, V., Erdmann, W., Gabathuler, K., Horisberger, R., ...
The Compact Muon Solenoid experiment at the Large Hadron Collider at CERN includes a silicon pixel detector as its innermost component. Its main task is the precise reconstruction of charged...
Building CMS Pixel Barrel Detectur Modules (2007)
König, S., Hörmann, Ch., Horisberger, R., Meier, B., Rohe, T., Streuli, S., ...
For the barrel part of the CMS pixel tracker about 800 silicon pixel detector modules are required. The modules are bump bonded, assembled and tested at the Paul Scherrer Institute. This article...
CMS Barrel Pixel Detector Overview (2007)
Kästli, H. Chr., Bertl, W., Erdmann, W., Gabathuler, K., Hörmann, Ch., Horisberger, R., ...
The pixel detector is the innermost tracking device of the CMS experiment at the LHC. It is built from two independent sub devices, the pixel barrel and the end disks. The barrel consists of three...
Development of an Indium Bump Bond Process for Silicon Pixel Detectors at PSI (2005)
Brönnimann, C, Glaus, F, Gobrecht, J, Heising, S, Horisberger, M, Horisberger, R P, ...
The hybrid pixel detectors used in the high energy physics experiments currently under construction use a three dimensional connection technique, the so-called bump bonding. As the pitch below 100um,...
Development of an Indium Bump Bond Process for Silicon Pixel Detectors at PSI (2005)
Broennimann, Ch., Glaus, F., Gobrecht, J., Heising, S., Horisberger, M., Horisberger, R., ...
The hybrid pixel detectors used in the high energy physics experiments currently under construction use a three dimensional connection technique, the so-called bump bonding. As the pitch below 100um,...