Packaging of radiation and particle detectors (2006)
Fritzsch, T., Jordan, R., Glaw, V., Töpper, M., Dietrich, L., Wolf, J., ...
Töpper, M., Klein, M., Buschick, K., Glaw, V., Orth, K., Ehrmann, O., ...
Wafer level package using double balls (2000)
Töpper, M., Glaw, V., Coskina, P., Auersperg, J., Samulewicz, K., Lange, M., ...
Töpper, M., Auersperg, J., Glaw, V., Kaskoun, K., Prack, E., Keser, B., ...
Wafer Level Packaging has the highest potential for future single chip packages. The package is completed directly on the wafer then singulated by dicing for the assembly in a flip chip fashion. All...
Wafer-level chip size package (WL-CSP) (2000)
Topper, M., Fehlberg, S., Scherpinski, K., Karduck, C., Glaw, V., Heinricht, K., ...
Size reduction is one of the main driving forces for packaging in nearly all electronic applications. The interaction of size reduction with highest functionality and high reliability is also...
High performance liquid cooled aluminium nitride heat sinks (1999)
Hahn, R., Glaw, V., Ginolas, A., Töpfer, M., Wittke, K., Reichl, H.
Baur, M., Schumm, T., Wertheimer, R., Schanz, M., Eckart, T., Nitta, C., ...
Im vorliegenden Beitrag wird ein hochsprachenprogrammierbares System zur schritthaltenden Vollbild-Interpretation natürlich beleuchteter Szenenfolgen im Videotakt vorgestellt. Im einzelnen werden...
Micro channel cooler for application for micro- and power-electronics (1997)
Hahn, R., Wittke, K., Glaw, V., Töpfer, M., Ginolas, A., Brunner, D.
Laser machining of ceramics for MCM-D applications (1997)
Glaw, V., Hahn, R., Wolf, J., Töpper, M., Buschick, K., Hein, U., ...
Hahn, R., Kamp, A., Ginolas, A., Schmidt, M., Wolf, J., Glaw, V., ...
High performance liquid cooled aluminium nitride heat sinks (1997)
Hahn, R., Glaw, V., Ginolas, A., Töpfer, M., Wittke, K., Reichl, H.
High performance cooling technology for Multi Chip Modules (MCM-D) with planar embedded dice (1997)
Hahn, R., Töpper, M., Schmidt, M., Kamp, A., Ginolas, A., Wolf, J., ...
Multichip modules (MCMs) offer significant reduction in both interconnection signal delay and microelectronics packaging volume. However, this integration results in higher heat flux densities in the...
Embedding technology - a chip-first approach using BCB (1997)
Töpper, M., Buschick, K., Wolf, J., Glaw, V., Hahn, R., Dabek, A., ...
With the current trend to ever faster clock rates the propagation delays between the chips constitute a significant portion of the clock cycle. Mounting both active and passive devices as closely...
Töpper, M., Glaw, V., Hahn, R., Schaldach, M., Schmaus, C., Bechtold, F., ...
Um unnötige kostenintensive Verfahrensschritte im Dünnfilmprozess zu vermeiden, ist der Einsatz von photosensitiven polymeren Dielektrika geboten. Hochtemperaturstabile photosensitive...
BCB - a polymer for thinfilm applications (1997)
Töpper, M., Ehrmann, O., Reichl, H., Glaw, V., Wolf, J., Fischbeck, G., ...
Thinfilm organic polymers have played a mayor role in the technologies of electronic packaging. Polymer films having low dielectric constants (less than 4) are being used to fabricate high density...
Töpper, M., Hahn, R., Kamp, A., Ginolas, A., Schmidt, M., Wolf, J., ...
This paper describes a novel packaging technology for high power multi chip modules (MCMs). The work covers three areas: The fabrication of a multichip module which provides access to the die...
Fabrication of high power MCMs by planar embedding technique and active cooling (1996)
Töpper, M., Hahn, R., Wolf, J., Glaw, V., Buschick, K., Hoehne, J., ...
This paper descibes the planar embedding technique for the fabrication of high power mulitchip modules (MCM-D). A back side planarizing process was developed which allowed a low thermal resistivity...
MCM-D with embedded active and passive components (1996)
Töpper, M., Wolf, J., Glaw, V., Buschick, K., Dabek, A., Dietrich, L., ...
A planar integration technology of bare dice together with passive SMDs embedded in ceramic substrates to yield a high-dense MCM-D is presented. The components are inserted into premanufactured...
Planare Multichip-Einbettung bei Dünnfilm-Hybriden auf keramischen Substraten (1995)
Buschik, K., Chmiel, G., Ehrmann, O., Glaw, V., Paredes, A., Wolf, J.