Yanhong Tian

Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints (2007)

Chen, Hongtao, Wang, Chunqing, Yan, Cheng, Huang, Y., Tian, Yanhong

SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution...

Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints (2007)

Chen, Hongtao, Wang, Chunqing, Yan, Cheng, Huang, Y., Tian, Yanhong

SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution...